E.i. Dupont De Nemours and Company

Joseph R Rellick

Sanford M Marcus

Christopher R Needes

Frank Knowles Patterson

The invention is directed to a method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes while maintaining excellent X-Y dimensional stability.

Method for fabricating multilayer circuits

The invention is directed to a method for fabricating multilayer circuits on rigid ceramic substrates using conventional dielectric green tape and thick film conductive pastes in which the number of firing steps is substantially reduced while maintaining excellent X-Y dimensional stability.

A casting composition for making dielectric green tapes comprising a dispersion of finely divided solids of (a) a noncrystallizable glass and (b) a mixture of refractory oxides in a solution of (c) organic polymer, which is readily depolymerizable at 825.degree.-1025.degree. C. in a nonoxidizing atmosphere, dissolved in (d) volatile nonaqueous solvent.

Dielectric compositions and method of forming a multilayer

A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

Conductive element metallized with a thick film gold composition

A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 95% by weight silver and 5 to 35% by weight cadmium/antimony alloy dispersed in a liquid vehicle.

Conductive element metallized with a thick film silver composition

Paste composition for electrical terminal contact metallization containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

Thick film gold metallization composition

Paste composition for metal surface metallization containing 65 to 95% by weight silver and 5 to 35% by weight cadmium/antimony alloy dispersed in a liquid vehicle.

Thick film silver metallization composition

The n-type region of a silicon solar cell is metallized with a nickel-antimony alloy to provide an external contact.

Silicon solar cell N-region metallizations comprising a nickel-antimony

A silicon solar cell is metallized with a nickel-antimony alloy to provide external contacts.

Solar cell metallizations comprising a nickel-antimony alloy

Thick film copper conductor compositions useful for forming microwave conduit conductors are disclosed. The compositions contain copper, copper oxide, lead oxide and bismuth oxide dispersed in an inert liquid vehicle.

Mixed oxide bonded copper conductor compositions

Air-fireable thick film conductor compositions are provided. The conductor composition is a paste containing (1) an inorganic powder made from an intermetallic phase copper-aluminum powder, aluminum powder and a glass frit and (2) an inert organic liquid vehicle.

Air-fireable conductor composition

Cobalt boride conductor compositions of certain cobalt borides and, optionally, inorganic binder, dispersed in a vehicle and fireable in air to produce conductive films on substrates. Also the resultant sintered (fired) films.

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Wilmington, DE, United States of America

Joseph R Rellick