Ppg Industries, Inc.

Westinghouse Electric Corporation

Joseph R Marchetti

Zal N Sanjana

Robert D Jerabek

Robert R Zwack

Rostyslaw Dowbenko

Timothy J Fuller

Carl C Anderson

Wilbur R Thomas

Edward Elikan

Disclosed in an emulsion having a discontinuous phase that consists of a water dispersed or water emulsified epoxy resin in water having at least two epoxide groups, a water soluble salt of an imide compound having at least one carboxyl group, and a crosslinking agent; the discontinuous phase has excess epoxide functionality. The continuous phase is water. A method of forming a coating on a conductive substrate is also disclosed. The substrate and an electrode are immersed into the emulsion and a direct current is applied between the substrate and the electrode to electrophoretically deposit a coating on the substrate of the epoxy resin, the imide compound, and the crosslinking agent. The substrate is removed from the emulsion and is heated to a temperature sufficient to cure the coating.

Polyimide modified epoxy resins in aqueous emulsions for lamination and

Disclosed is a composition comprising about 5 to about 95 phr of a polyepoxide or other resinous component, about 20 to about 90% of an aprotic solvent, about 5 to about 95 phr of a polyimide having sufficient amic acid functionality to be soluble in the solvent, and sufficient water to hydrolyze the polyimide. A laminate is made from the composition by heating it until the amic acid functionality is substantially eliminated, then impregnating a fibrous substrate with the composition, heating the impregnated substrate to evaporate the solvent and B-stage the composition and form a prepreg, forming a stack of the prepregs, and heating and pressing the stack of prepregs to cure the composition. A wire enamel can also be made from the composition.

Compatible self-crosslinking poly (amide-imide) polyepoxide resin blends

The invention discloses a polyfunctional imide-containing phenolic imide which is the reaction product of a polyanhydride having at least three anhydride groups and aromatic compound having a single aromatic primary amine group. A varnish is prepared by the addition of an epoxy crosslinking agent to the imide. Fibrous substrates can be impregnated with the varnish and partially cured to prepare prepregs, and stacks of prepregs can then be heated and pressed to prepare laminates or printed circuit boards.

Epoxy crosslinked copolymers of polyanhydrides and laminates therefrom

Disclosed is a composite of a polyaramid woven fabric and a resin. The resin contains water, a water-based emulsion of an epoxy selected from the group consisting of diglycidyl ethers of bisphenol A, diglycidyl ethers of bisphenol F, novolacs, and mixtures thereof, water-compatible curing agents for the emulsion, and a water-compatible catalyst for the emulsion. The emulsion can be cured to the B-stage to form a prepreg and prepregs can be stacked with copper sheets and heated and pressed to form a laminate for use in making a printed wiring board.

Polyaramid laminate

Disclosed is a water-based thermosetting epoxy composition of a water compatible epoxy resin, about 5 to about 35%, based on a total solids, of a water compatible impact modifier, about 1.5 to about 7%, based on the weight of the epoxy resin, of a water compatible epoxy hardener, up to about 0.3%, based on the weight of the epoxy resin, of a catalyst, and sufficient water to provide a viscosity of about 100 to about 500 centipoises. The impact modifier is a copolymer of about 10 to about 60% ethylene, propylene, or mixtures thereof, and about 40 to about 90% vinyl acetate, vinyl chloride, or mixtures thereof. Also disclosed are laminates prepared from this composition and a method of preparing them.

Toughened thermoset laminates

A prepreg useful in flame resistant copper clad printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a prebrominated epoxy resin or a mixture of a non-halogenated epoxy resin and flame retarding additive containing bromine, and phenolic hydroxyl groups. A phenolic novolac oligomer having an average of over 2.5 phenolic hydroxyl groups per oligomeric unit is used as curing agent. Optionally, a suitable catalyst may be included. The impregnated substrate is heated to cure or advance the resin to the 'B'-stage.

Flame retardant B-staged epoxy resin prepregs and laminates made

Disclosed is a water based thermosetting epoxy composition of a water compatible epoxy resin, about 5 to about 35% based on total solids of a water polymerized impact modifier in a water based latex, about 1.5 to about 7% based on the weight of the epoxy resin of a water compatible epoxy hardener, up to about 0.3% based on the weight of the epoxy resin of a catalyst, and sufficient water to provide a viscosity of about 100 to about 400 centipoises. The compositions are used to prepare high impact strength, high damping laminates.

Toughened thermosetting compositions for composites

Novel, chain-extended adducts formed from reacting high molecular weight polyepoxides and polyester polyols containing at least two alcoholic, primary hydroxyls per molecule are disclosed. The chain-extended polyepoxides are adducted with a secondary amine and made dispersible in water with acid. The water-dispersed resins can be applied to a wide variety of substrates by cationic electrodeposition. When compared to resins which are not chain extended, the resins of the invention have higher rupture voltages, improved film-forming properties and deposit as films with improved flexibility.

Amine acid salt-containing polymers for cationic electrodeposition

Novel, chain-extended adducts formed from reacting high molecular weight polyepoxides and organic polyols containing at least two alcoholic, primary hydroxyls per molecule are disclosed. The chain-extended polyepoxides are adducted with a secondary amine and made dispersible in water with acid. The water-dispersed resins can be applied to a wide variety of substrates by cationic electrodeposition. When compared to resins which are not chain extended, the resins of the invention have higher rupture voltages, improved film-forming properties and deposit as films with improved flexibility.

Process for cationic electrodeposition of amine acid salt-containing

Coating compositions applicable by conventional coating techniques as well as by electrodeposition are provided by reacting an epoxy-containing organic material with a compound containing at least one phenolic hydroxyl group and a group hydrolyzable to a carboxyl group. Examples of such hydrolyzable groups include ester groups, amide groups and nitrile groups. Compounds include esters of benzoic, salicylic and diphenolic acids, and phenolphthalein. The resultant product may then be hydrolyzed and solubilized, using any of the known hydrolyzing agents, e.g., aqueous potassium hydroxide, aqueous sodium hydroxide and aqueous solutions of the various amines used in the art.

Hydrolyzed reaction product of a polyepoxide with a phenolic compound

The pH, dispersibility and throw power of amine group-solubilized, epoxy resin-derived, cationic electrodepositable resins can be enhanced by the incorporation of primary amine groups into the resin molecule. The primary amine groups are incorporated by reacting certain polyamine compounds in which the primary amine groups are blocked by ketimine groups into the acid solubilizable, amine group-containing electrodepositable resins derived from epoxy group-containing resins.

Ketimine-blocked primary amine group-containing cationic

Long chain compounds containing both mono-substituted urea linkages, as well as urethane linkages, have been prepared which serve as reactive plasticizers with resins containing epoxy, amine and hydroxyl groups. These materials are particularly useful as reactive plasticizers with cationic electrodepositable compositions containing acid solubilized base groups.

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Greensburg, PA, United States of America

Joseph R Marchetti