Amp LLC

Joseph R Goodman

Timothy B Billman

John A Woratyla

Dale R Zell

John Michael Landis

George H Douty

John C Asick

Clair W Snyder, Jr

Kermit M Jones, Jr

Gary R Marpoe, Jr

Roger Lee Thrush

James R Coller

A burn-in socket adapted for use with plastic quad flat pack packages having gullwing leads is disclosed. The socket comprises an insulative housing base and a reciprocal cap frame located on top of the insulative housing. A plurality of resilient contact terminals are positioned along the sides of the insulative housing around the periphery of a cavity for receiving the PQFP package. Each contact terminal is inwardly deflectable upon movement of the cap so that gullwing leads of the PQFP package will be received between the contact terminal and an inwardly facing ledge. The socket is suitable for use with automatic loading equipment.

Burn-in socket for integrated circuit device

An integrated circuit package socket includes an insulating housing having a plurality of side by side terminals profiled for receipt of a square package with leads extending therefrom. The socket also includes a camming member disposed above the housing which has a camming surface which contacts a portion of each of the terminals to move the terminals into and out of electrical engagement with the leads of the package. The camming member multiplies the force applied directly to the camming member to cause the desired rotation. Relaxation of the camming member causes a reverse rotation of the contacts into electrical engagement with the package leads.

Burn-in socket for gull wing integrated circuit package

A printed circuit board mountable switch includes a insulative body having a plurality of leads extending out of the body, the leads being formed into two parallel and opposed rows with fixed ends of the leads being spaced apart and facing each other on the floor of the body. A slide switch element includes a bow shaped element having first and second contact elements adjacent to respective first and second fixed ends of the leads. The switch element is moveable between a first position where the switch element bridges between the associated first and second lead fixed ends, to a position where the second contact portion only, is in contact with the second fixed end of the lead. The housing body including integrally molded ramps or cams which flank the width of the first and second fixed ends and at least partially extend therebetween. The slide switch element includes at the first contact end, a T-shaped shunt element which includes tabs complementary with the two ramps, such that upon sliding movement of the slide element, the first contact end is lifted vertically off of the floor of the housing.

Slide switch configured as an integrated circuit package

Four embodiments of a burn-in socket for gull wing configured semiconductor packages are disclosed where each of the embodiments includes latching means which a mechanical advantage assisting in the installation of the carrier and package. Two of the embodiments include four centered posts which include helical ramparts which contact directly on the upper surface of the carrier. A third embodiment is disclosed which includes a lid which rotates over the upper face of the carrier, where the cover includes a post having a helical rampart where the helical rampart contacts a shoulder of the socket which lowers the cover. The fourth embodiment discloses two overlapping doors where the outer door contacts the inner door thereby closing the inner door moving the carrier downward.

A burn-in socket for a zig-zag inline package includes an insulative housing carrying a plurality of electrical terminals which include convexly formed sections defining contact portions. The apices of the convexly formed sections are laterally offset to increase the amount of deflection obtainable from any given thickness of package lead. The convexly formed sections are axially offset to stagger the insertion force and the terminals are designed to plastically deform under certain conditions to limit the normal force between the contacts and the package leads.

Burn-in socket for zig-zag inline semiconductor package

A multi plane connector system is formed by a header assembly mounted on at least one side of a circuit board and a connector commoning terminals of header assemblies on adjacent circuit boards. The terminals of the header assemblies can either be through-the-board mounted or surface mounted in either a soldered or spring loaded condition. The connector preferably includes latching means and can be back plane or ground plane mounted.

Multi-plane interconnection system

A connector for interconnecting a zig-zag inline package to a printed circuit board has a plurality of contacts in two parallel and offset rows. The contacts are dimensionally controlled to be preloaded only when installed in the housing cavity, providing predictable preload and resultant insertion force. The connector also includes a decoupling capacitor, integral with the contacts which contact the power and ground lead of the integrated circuit package.

Socket for zig-zag inline package

A connector for interconnecting a zig-zag inline package to a printed circuit board has a plurality of contacts in two parallel and offset rows. The contacts and housing are dimensionally controlled to be preloaded only when installed in the housing cavity, providing predictable preload and resultant insertion force. The connector also includes a decoupling capacitor, integral with the contacts which contact the power and ground lead of the integrated circuit packages.

A socket for stacking and interconnecting corresponding leads of two integrated circuit packages having the contacts stamped and formed in a lead frame configuration with a dielectric body molded over a portion of the terminal ends. Two contact halves are sheared from the opposite end of the terminal, one contact formed upwardly while the second contact is formed downwardly. Integrated circuit package leads can be selectively commoned by jumpering the terminal ends prior to molding the body.

Socket for stacking integrated circuit packages

A bussing system for interconnecting circuits on pairs of adjacent parallel spaced circuit boards is formed by a bussing connector for each pair of circuit boards and a connector assembly on each circuit board. Each connector assembly has a header mounted on a first side of the circuit board, a shroud mounted on the opposite side of the circuit board, and a plurality of terminals mounted extending through the header, shroud and circuit board and making electrical contact with the latter. Each bussing connector includes a plurality of terminals mounted therein, each capable of engaging a pin terminal extending from a header of a first circuit board and a pin terminal extending from a shroud of a second circuit board.

Bussing connector system

A bussing system for interconnecting pairs of circuit boards in a closely spaced array of parallel spaced circuit boards is formed by a bussing connector for each pair of circuit boards and a pair of blade headers on each circuit board. The first header is mounted on a first side of a respective circuit board and the second header is mounted aligned on the opposite side of the circuit board. Each header is provided with a plurality of terminals having one end in electrical contact with the circuitry of the circuit board and an opposite end projecting from the respective header. The bussing connector has a housing containing a plurality of terminals each arranged to engage a terminal extending from a first header of a first circuit board and a terminal extending from a second header of an adjacent second circuit board.

Bussing system for stacked array of panel boards

An electrical connector, having a programmable ground feature, is formed by a housing having a mating face, a bussing surface and a plurality of terminal passages extending between the face and the surface. A like plurality of terminals is provided, each mounted in a respective passage, and having a mating portion directed toward the mating face, an intermediate conductor engaging portion, and a detachable buss engaging portion lying on the bussing surface. A conductive buss bar engages the buss portions lying on the buss surface to selectively common the respective terminals. A further module carrying commoned terminals can be mated with the connector to provide a high density, programmable grounding connector.

Growing community of inventors

Walkertown, NC, United States of America

Joseph R Goodman