Raytheon Company

Allegro Microsystems, LLC

Joseph R Ellsworth

Craig H McCordic

Scott R Cheyne

Jeffrey Paquette

Michael P Martinez

Todd E Southard

Stephen J Pereira

Caroline Margaret Manteiga

Douglas Moriondo

Angelo M Puzella

David H Altman

Travis L Mayberry

Ethan Santosh Heinrich

Joseph A Licciardello

Joseph M Crowder

Dimitry Zarkh

Paul A Danello

Thomas J Tellinghuisen

David A Brooks

Corey R DeLisle

Michael R Trahan

Michael E Null

Steven M Lombardo

Joseph Angelo DelGenio

Costas Karageorgis

Christopher Robert White

Adam Carl Rickis

Dennis Proulx

Douglas J Moriondo

An assembly is provided for an electronic system. This electronic system includes a base and an electronic component. The base includes a base connector, a bay and a first guide. The first guide is arranged along a first side of the bay. The electronic component is configured to mate with the first guide and to move along the first guide within the bay to an installed position. The electronic component includes a component connector and a brake. The component connector is configured to couple with the base connector when the electronic component is at the installed position. The brake is engageable as the electronic component moves along the first guide to the installed position.

Brake for an electronic component

A modular phased array antenna that includes a plurality of modular antenna array blocks assembled together as a single antenna array and an array face having an array plate and a radiator and radome assembly for each modular block interlocked and aligned to create a single monolithic array face. Each modular antenna array block includes: a plurality of transmit/receive integrated multichannel module (TRIMM) cards, each TRIMM card including power and beamforming signals, where power and beamforming signals are connected in parallel to each modular antenna array block, a plurality of radiators for radiating antenna signals having a radiator face, a radome integrated with the plurality of radiators and interfacing directly to the radiator face, where the radome does not extend beyond the radiator face, and a frame for supporting the TRIMM cards.

Modular and stackable antenna array

A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.

Ultrasonic additively manufactured coldplates on heat spreaders

An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.

Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones

A coolant interface includes a line replaceable unit (LRU) inserted into a slot within a modular assembly such as a chassis for an electronics assembly. Quick disconnect fluid coupling fittings on the LRU mate with counterpart fittings on a fluid distribution manifold within the chassis when the LRU is inserted into the slot. A seal surrounding the quick disconnect fluid coupling fittings on a flat surface abutting a counterpart surface on the fluid distribution manifold when the LRU is inserted into the slot compresses the seal against the counterpart surface. Alignment pin(s) projecting from the flat surface and received by corresponding guide holes within the counterpart surface, and captive hardware provides pressure between the flat surface and the counterpart surface to increase and maintain compression of the seal. The alignment pins and captive hardware are arranged to increase mechanical stability of the connection.

Multi-purpose coolant interface

An air-cooled heat exchanger includes a housing having an intake for air flowing through the housing and at least one outlet for the air flowing through the housing. A set of segmented fins extend within the housing between the intake and the at least one outlet, configured to direct the air flowing through the housing. Each segment of the segmented fins has a length selected based on a throw distance for an environmental protection coating process employed to apply an environmental protection coating to surfaces of the fin segments. Access ports extend through at least one wall of the housing at locations allowing connection, when the access ports are unblocked, of electrical conductors used in the environmental protection coating process to both ends of each of the fin segments. Access port covers block each of the access ports during operation of the air-cooled heat exchanger.

Tailoring air cooled heat exchanger geometry to achieve environmental protection

In one aspect, a radar array assembly includes two or more vertical stiffeners each having bores with threads and a first radar module. The first radar module includes radar transmit and receive (T/R) modules and a chassis having channels configured to receive a coolant. The chassis includes shelves having ribs. The ribs have channels configured to receive the coolant and the ribs form slots to receive circuit cards disposed in parallel. The circuit cards include the T/R modules. The chassis also includes set screws attached to opposing sides of the chassis. The set screws have bores to accept fasteners to engage the threads on a corresponding one of the two or more vertical stiffeners. The first radar module is configured to operate as a stand-alone radar array.

Modular architecture for scalable phased array radars

A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Heat sink interface having three-dimensional tolerance compensation

In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

Cooling active circuits

In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Assembly to provide thermal cooling

A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Method and apparatus for thermal management of a radio frequency system

A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer.

High performance power device

A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.

Distributed transmit/receive integrated microwave module chip level cooling system

An edge cooled graphite core aluminum cold plate for use in phased array radar systems, the cold plate including opposing aluminum skins, and a core layer sandwiched between the opposing aluminum skins. The core layer includes graphite surrounded by an aluminum body. The aluminum body includes inwardly directed tabs extending from opposing cooled edges of the cold plate, the inwardly directed aluminum tabs having orifices therethrough. The opposing aluminum skins also includes orifices therethrough aligned with the orifices in the tabs of the aluminum body to reduce the conductivity of the cooled edges of the cold plate thus reducing the temperature gradient between edge mounted heat sources and inwardly mounted heat sources without adversely affecting the structural integrity of the graphite core layer.

Growing community of inventors

Worcester, MA, United States of America

Joseph R Ellsworth