Dow Corning Corporation

Joseph Peter Kohane

Jonathan David Wineland

Unnikrishnan R Pillai

Roland L Halm

Steven K Freeburne

Jonathan D Wineland

The invention pertains to a process for the preparation of organohalosilanes. The process comprises contacting a first finely-divided silicon comprising from 0.08 to 0.25% (w/w) of aluminum with an organohalide in a reactor at a temperature of from 250 to 350&#xb0; C. in the presence of a Direct Process catalyst comprising copper, and a promotor; and introducing a second finely-divided silicon into the reactor comprising from 0.001 to &#x3c;0.10% (w/w) of aluminum into the reactor as needed in an amount sufficient to maintain an aluminum concentration of from 0.08 to 0.2% (w/w), based on a weight of unreacted silicon and aluminum.

Method of making organohalosilanes

The invention pertains to a method of producing organohalohydrosilanes by treating a silicon metal with a halogen-containing compound, wherein the halogen-containing compound has a formula selected from RSiX(II) and RX (III), combining a catalyst and a promoter with the treated silicon metal, and contacting the combination with hydrogen gas and an organohalide. The invention also pertains to a method of producing organohalohydrosilanes by contacting an organohalide and hydrogen gas with a combination of silicon metal, a catalyst, a promoter and a hydrogen storage material. The invention also pertains to a method of producing organohalohydrosilanes by contacting an organohalide and hydrogen gas with a combination of a silicon metal, a catalyst, a promoter and a hydrogenation catalyst. The invention also pertains to a method of producing organohalohydrosilanes by contacting an organohalide and hydrogen gas with a reaction mass residue and optionally a hydrogenation catalyst.

Process for producing organohalohydrosilanes

The present invention is an improved process for the reaction of an alkyl halide with particulate silicon in a fluidized-bed process. The improvement comprises controlling the particle size of the silicon within a range of one micron to 85 microns. Preferred is when the particle size of the silicon has a mass distribution characterized by a 10th percentile of 2.1 to 6 microns, a 50th percentile of 10 to 25 microns, and a 90th percentile of 30 to 60 microns. Most preferred is when the particle size mass distribution of the silicon is characterized by a 10th percentile of 2.5 to 4.5 microns, a 50th percentile of 12 to 25 microns, and a 90th percentile of 35 to 45 microns. The process is run in the presence of a catalyst composition comprising copper and other catalysts.

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Indianapolis, IN, United States of America

Joseph Peter Kohane