Force10 Networks, Inc.

Dell Products Inc.

Joseph Pankow

Joel R Goergen

Greg Hunt

Peter Tomaszewski

Michael Laudon

The characteristic impedance of a surface pad is manipulated by reticulating the pad and filling the spaces with a dielectric material, providing an inductive element in the coupling of the surface pad to an underlying ground pad of a ground plane, or a combination of these approaches. In appropriate embodiments, acceptable signal trace routing paths will exist in an embedded signal layer under the ground plane and crossing under the surface pad. Other embodiments are also described and claimed.

Method of fabricating a circuit board

Impedance tuning for circuit board signal path surface pad structures

Plated through holes pass through clearances in a ground plane of a circuit board. A conductive collar/spoke arrangement is constructed on the ground plane adjacent the clearance, to provide an inductive component to the coupling between a plated through hole and the ground plane. The inductive component impedes the transfer of high-frequency noise between the through hole and the ground plane. Other embodiments are also described and claimed.

Inductance-tuned circuit board via crosstalk structures

Growing community of inventors

Sunnyvale, CA, United States of America

Joseph Pankow