Motorola Corporation

Joseph P Tomase

Marc Kenneth Chason

Michael J Onystok

Lawrence N Dworsky

Shiuh-Hui Steven Chen

David J Anderson

Steven Clay Moore

Roy E Hunninghaus

Robert G Kinsman

Gary L Christopher

Kevin M Andrews

Gregory D Stamm

Carl A Kotecki

Donald J Ryback

Kenneth J Nield

An electronic control module (10) includes a circuit substrate (12) containing a plurality of thermal vias (36) and a heat-generating electronic device (26) attached to the thermal vias (36). The circuit substrate (12) is attached to a mounting plate (18) by a plurality of electrically-isolated, thermal attachment pads (20) located at selected positions on an electrically insulating layer (16) overlying a metal baseplate (14). A solder layer (22) functions to both mechanically attach the plurality of thermal vias (36) to the plurality of thermal attachment pads (20), and to provide a thermal dissipation pathway for heat generated by the electronic devices (26). The heat is transferred from the circuit substrate (12) through the plurality of thermal attachment pads (20) to the metal baseplate (14).

Solder bonded electronic module

A hermetically sealed interface is constructed with a substrate (101) having a first surface (103) with a first orifice (201). The substrate (101) also has an opposing second surface (105) with a second orifice (205). The first and second orifices (201, 205) are connected via a passageway (107). The passageway (107) has an inner surface (209) with a first metal coating (111). The first metal coating (111) and the substrate (101) provide a first predetermined thermal coefficient of expansion for the passageway (107). A plug (221) with an outer surface (223) has a second metal coating (225). The second metal coating (225) and the plug (221) provide a second predetermined thermal coefficient of expansion substantially similar to the first predetermined thermal coefficient of expansion of the passageway (107). The plug (221) is disposed in the passageway (107) of the substrate (101). The first metal coating (111), of the inner surface ( 209) of the passageway (107), and the second metal coating (225), of the outer surface (223) of the plug (221), are bonded together and provide, with the plug, (221) a hermetic barrier between the first and second orifices (201, 205) of the substrate (101). Preferably, this hermetically sealed interface is used in a capacitive pressure sensor.

Hermetically sealed interface

An improved method and apparatus is disclosed for perpendicularly mounting an AT-strip resonator on its longitudinal edge. The crystal blank is secured to the base at two or more mounting points via conductive cement which provides both electrical connection and mechanical support. A mounting cavity or slot permits proper positioning and self-fixturing during manufacture. The edge-mounting configuration promotes ease of manufacture, improved shock performance, minimized motional resistance degradation, and high packing density.

Edge-mounting configuration for at-strip resonators

A piezoelectric device package consists of a base and a cover which are sealed together to hermetically seal a piezoelectric device such as a quartz crystal therebetween. A recess in the cover receives the quartz crystal. Feedthrough holes in the base, or the cover, or both, which have electrostatic seals formed over them provide a means for making electrical connections with the quartz wafer while still maintaining the hermetic seal.

Electrostatically sealed piezoelectric device

Growing community of inventors

Libertyville, IL, United States of America

Joseph P Tomase