Agilent Technologies, Inc.

Joseph P Groshong

Brent Anthony Holcombe

John C Barker

Brock J LaMeres

William Richard Huseby

Donald Earl Schott

Andrew Grieder

A probe includes an electrical element. The probe has reduced parasitic loading. A probe assembly with a plurality of probes is also disclosed.

Signal probe and probe assembly

A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film ceramic substrate with a first side and a second side with a heat spreader or a heat sink on the second side. An IC die may be attached to the heat spreader or heat sink through the laser cut die cavity and wire bonded to pads on the first side of the ceramic substrate. The thick film ceramic substrate may have one or more integrated passive components.

Method and apparatus for high electrical and thermal performance ball grid array package

A bonding system is provided that bonds a heat sink to a printed circuit assembly. The bonding system includes an adhesive applicator that is configured to hold an adhesive layer, and a heat sink holder that is configured to hold a heat sink while the adhesive applicator applies the adhesive layer to the heat sink.

Growing community of inventors

Colorado Springs, CO, United States of America

Joseph P Groshong