Merrimac Industries, Inc.

Joseph McAndrew

Rocco A De Lillo

James J Logothetis

A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Spiral couplers manufactured by etching and fusion bonding

Multi-layered spiral couplers on a fluropolymer composite substrate

A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Growing community of inventors

Wharton, NJ, United States of America

Joseph McAndrew