Other

Applied Materials, Inc.

Lambda Technologies, Inc.

Joseph M Wander

Zakaryae Fathi

Iftikhar Ahmad

Clayton R DeCamillis

Keith R Hicks

Richard S Garard

Richard C Hazelhurst

Michael L Hampton

William L Geisler

A backing with corrugations on a first surface. The corrugations are parallel and each has an airspace along an entire longitudinal length. A second surface of the backing includes perforations or scores oriented perpendicularly or parallel to the corrugations. The corrugations or scores are fold lines or frangible tear lines. The airspaces may also include a filter material. The second surface of the backing may be adhered to a corner of a rolling paper on the surface but opposite edge as a gum strip. The corrugations are parallel to the gum strip.

Cigarette tip

A materials processing system comprises a thermal processing chamber and a broadband microwave power source. The power source includes an ovenized small-signal RF circuit, a high power microwave amplifier, and forward and reflected power detectors separated from one another by an isolator. The power detectors are also preferably ovenized. A control system provides control signals to the thermally stabilized VCO and VCA in the small-signal circuit to control output power based on detected forward power compared to demanded forward power. The system may be run in either open-loop or closed-loop modes.

Method and apparatus for controlled broadband microwave heating

An apparatus for heating a semiconductor wafer includes: a microwave source; an applicator cavity; and, a fixture for supporting a wafer in the cavity. The fixture includes a dielectric mechanical support for the wafer and a grounded metallic ring movably positioned parallel to and concentric with the wafer at some distance from the wafer, to adjust the microwave power distribution to compensate for edge effects. A closed-loop feedback system adjusts the distance based on wafer edge and center temperatures. A method for heating a semiconductor wafer includes: a. placing the wafer in a microwave cavity; b. supporting the wafer on a fixture comprising a dielectric wafer support and a grounded metallic ring movably positioned at some distance from the wafer; c. introducing microwave power into the cavity to heat the wafer; and d. adjusting the distance between wafer and ring to modify the power distribution near the wafer edge.

Apparatus and method for heating semiconductor wafers via microwaves

An apparatus for heating a semiconductor wafer includes: a microwave source; an applicator cavity; and, a fixture for supporting a wafer in the cavity. The fixture contains a dielectric mechanical support for the wafer and a grounded metallic ring movably positioned parallel to and concentric with the wafer at some distance from the wafer, to adjust the microwave power distribution to compensate for edge effects. A closed-loop feedback system adjusts the distance based on wafer edge and center temperatures. A method for heating a semiconductor wafer includes: a. placing the wafer in a microwave cavity; b. supporting the wafer on a fixture having a dielectric wafer support and a grounded metallic ring movably positioned at some distance from the wafer; c. introducing microwave power into the cavity to heat the wafer; and d. adjusting the distance between wafer and ring to modify the power distribution near the wafer edge.

In-situ and post-cure methods of joining optical fibers and optoelectronic components are provided. An in situ method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with non-ionizing radiation in RF/microwave energy to rapidly cure the resin. A post-cure method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that the signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with microwave energy to partially cure the resin. The joined components are then transferred to a curing oven to fully cure the adhesive resin.

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Chapel Hill, NC, United States of America

Joseph M Wander