Rockwell International Corporation

United States of America As Represented by the Secretary of the Air Force

Joseph M Shaheen

Stanley R Dawson

John Simone

James S Yamaguchi

Edward A Escallier

Leo J Quintana

Andrew J Niedzwiecke

Herbert W Yancey

The present invention eliminates the release of vapors from an adhesive which bonds an organic multilayer substrate to a ceramic layer. Posts from the organic layer are plated up sufficiently high as to enter holes in the ceramic layer, but not completely penetrate through them. The holes may then be filled with solder, which both seals the holes against the escape of adhesive vapors and makes a good electrical contact with the post. A conductive pad may then be stenciled on top of the solder plug, and the chip or other electric component mounted to the pad. The hole is preferably plated with a conductive material prior to being filled with solder, so that solder may join the plating with the post. The solder plug is formed by forming a slurry of solder with alcohol, which is squeegeed into the holes and fused under pressure. A solder paste is then stenciled over the fused soldered power and is, itself, fused using the vapor phase. A plurality of interconnection substrates may be formed from a single organic/inorganic panel, broken or sawed apart along score lines.

Hermetic organic/inorganic interconnection substrate for hybrid circuit

The present invention eliminates the release of vapors from an adhesive which bonds an organic multilayer substrate to a ceramic layer. Posts from the organic layer are plated up sufficiently high as to enter holes in the ceramic layer, but not completely penetrate through them. The holes may then be filled with solder, which both seals the holes against the escape of adhesive vapors and makes a good electrical contact with the post. A conductive pad may then be stenciled on top of the solder plug, and the chip or other electric component mounted to the pad. The hole is preferably plated with a conductive material prior to being filled with solder, so that the solder may join the plating with the post. The solder plug is formed by forming a slurry of solder with alcohol, which is squeegeed into the holes and fused under pressure. A solder paste is then stenciled over the fused soldered power and is, itself, fused using the vapor phase. A plurality of interconnection substrates may be formed from a single organic/inorganic panel, broken or sawed apart along score lines.

A multi-layer board is fabricated by plating up conductive posts on a nonconductive layer. The tops of the posts are planarized, resulting in sharp corners. The posts are aligned with a template, which has a hole above each post, and a second nonconductive layer is placed between the top of the posts and the bottom of the template. The two layers are laminated together by compressing the second layer between the first layer and the template, and the posts punch through the second layer. Conductive traces may then be etched or deposited between the posts tops, and the process may be repeated as many times as desired.

Method of fabricating multi-layer board

A multilayer board comprising a novel construction of ceramic and organic layers to reduce difficulties commonly encountered by board materials and components attached thereto having differing thermal coefficients of expansion. The multilayer board comprises an inorganic ceramic surface which is affixedly attached via a compliant adhesive to a conventional plated up post or plated thru hole organic multilayer board.

Ceramic/organic multilayer interconnection board

A multiconductor flat cable incorporates an approximately right angle turn in its conductor runs. The right angle turn is provided by first securing the conductor runs in a desired spacing through a first lamination of insulation cover and base sheets while leaving portions of the conductor runs exposed through a window in the first lamination. The first lamination is then severed at the lateral edges of the window so that an end portion of the first lamination may be moved ninety degrees relative to a remaining body portion thereto. The right angle turn is then secured by forming a second lamination with cover and base layers so as to overlap the first lamination and the turn in the conductor runs.

Method for assembling a multiconductor flat cable

Multiconductor flat cable

A fiber optic cable for connecting at least one optical transmitter to at least one optical sensor in an electronic assembly, the fiber optic cable comprising: a first surface layer; a second surface layer, the first and second surface layers being in stacked parallel plane relation; a resin layer, the first surface layer and the second surface layer being bonded together by the resin layer; at least one fiber optic filament, each fiber optic filament being embedded in the resin layer in a predetermined pattern; means for terminating each respective fiber optic filament to facilitate optically coupling each respective optical transmitter to a respective optical sensor; the first surface layer, the second surface layer, the resin layer and the fiber optic filament being laminated forming a relatively flat ribbon cable having a cross section relatively free of voids; whereby the fiber optic cable is formed as a relatively thin, flexible, flat layer facilitating installation in an electronic assembly.

Fiber optic cable

The invention comprises a connection array for establishing a plurality of electrical connections between circuit pads of a support, such as a circuit board, and contacts of an electrical housing, such as a hermetic chip carrier, wherein the contacts comprise semi-circular vertical indentations in the housing periphery with each indentation having a conductive layer therein. A plurality of pillars, which may be electroplated, extend vertically above the support in an array respectively corresponding to the outline of the indentations with each pillar being connected to different pad of the support and the pillars having dimensions to permit at least partial entry into the indentations whereby solder may be introduced between the pillars and associated conductive layers to establish visible and inspectable electrical connections therebetween.

Connection array for interconnecting hermetic chip carriers to printed

A method of etching a surface of a body including the steps of applying a suitable modified epoxy thermo-setting adhesive coating to an etchant resisting masking film; punching the masking film in a predetermined pattern corresponding to the pattern to be etched on the body; applying the masking film to a major surface of the body to be etched, thereby exposing a portion of the major surface corresponding to the predetermined pattern; setting the adhesive coating by applying heat so that the masking film is securely attached to the body; and subsequently applying an etchant to the body covered by the making film so that the predetermined pattern is etched into the major surface of the body.

Method of etching a surface of a body

A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.

High temperature-resistant conductive adhesive and method employing same

An electrically and thermally conductive adhesive containing a metal alloy dispersed in a resin is disclosed. The composition of the adhesive may include a resin mixture and a gallium-metal alloy. The composition is very stable, is a liquid at room temperature and cures at a relatively low temperature with excellent adhesion and conduction properties and is resistant to relatively high temperatures.

Conductive adhesive for providing electrical and thermal conductivity

A method for producing beam leads, i.e. electrical contacts, on flexible circuits or multilayer circuits for interconnecting devices is disclosed. The method consists of processing a metal foil to expose a beam lead interconnection pattern, plating the exposed pattern with metal, coating a base insulating layer with an adhesive, punching cavities in the adhesive coated insulating layer, engaging the coated side of the base insulating layer to the metal foil, and applying a cushioning material on the opposite side of the adhesive coated insulating layer. The metal foil and the insulating layer are then laminated causing the cushioning material to flow into the pre-punched cavities thereby providing a protective cushioning-type backing for the metal-plated beam lead interconnection pattern. The exposed metal foil is etched away, the photoresist is removed and the cushioning material is stripped off the insulating layer leaving beam leads extending over the cavity for a device which can have the beam leads connected to its contacts (pads).

Method of fabricating a beam lead flexible circuit

A carrier for making electrical connection with a microelectronic device without bonding the device to the carrier is disclosed. The carrier is designed to accommodate a device such as, but not limited to, a magnetic bubble domain memory chip. The circuit board and keeper board are joined by a hinge having tension means to readily permit opening and locking of the carrier. When the carrier is in the open position, a device is positioned in the carrier. By locking the carrier, the device is secured and the required electrical connection is made between the carrier and the device. The carrier can now be connected to a test fixture for evaluating the electrical characteristics of the chip without bonding any leads or the carrier may be utilized in a system as an integral part of that system.

Carrier for devices

A composite comprising a flexible substrate structure including a base and support members projecting therefrom; a network of resistor segments; a conductor network interposed between the resistor network and the base of the substrate structure for cooperating with the projecting support members of the substrate structure to support the resistor segments and for supplying power to the resistor segments; and, a backup board affixed to the substrate on the side thereof opposite the resistor segments. The composite can be used, e.g., as the printing element in thermal print heads. The resistor network can be formed on top of the conductor network by casting the flexible projecting support members on the base between the conductors flush with the outer surfaces of the conductors for supporting the resistor network thereon. Alternatively, the projecting support members and the base can be formed as one piece.

Growing community of inventors

La Habra, CA, United States of America

Joseph M Shaheen