Delphi Technologies, Inc.

Delco Electronics Corporation

Delphi Technologies IP Limited

Joseph M Ratell

Daniel A Lawlyes

James Ira Moyer

Bruce Alan Myers

Steven T Reyburn

Paul J Pitzer

John M Hart, Jr

Michael T Dolce

Perry L Martinson

Bruce Myers

A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.

Liquid cooled power electronic circuit comprising stacked direct die cooled packages

An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.

Electronic enclosure with continuous ground contact surface

A duplexer assembly is provided and includes a circuit board and a duplexer connected to the circuit board by a joint material, wherein the joint material provides a joint thickness of at least about 10 mils.

Structure and method for improving the reliability of surface mounted ceramic duplexers

A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.

Method of making thick film pressure and temperature sensors on a stainless steel diaphragm

A pressure sensor connector ( ) for use with a pressure sensor element ( ) that includes a plurality of pressure sensor terminals ( ). The pressure sensor connector ( ) includes a housing ( ), a plurality of connector terminals ( ) and a flexible circuit ( ). A plurality of electrical pathways ( ), formed on the flexible circuit ( ), connect each of the plurality of connector terminals ( ) to a corresponding pressure sensor terminal ( ).

Pressure sensor connector

A pressure sensor connector ( ) for use with a pressure sensor element ( ) that includes a plurality of pressure sensor terminals ( ). The pressure sensor connector ( ) includes a cap ( ), a plurality of connector terminals ( ) and a frame element ( ). A plurality of contacts ( ), included in the frame element ( ), connect each of the plurality of connector terminals ( ) to a corresponding pressure sensor terminal ( ).

A media-compatible, high-pressure transducer cell (12), a rugged sensor assembly (10) incorporating the cell (12), and a method for its production. The pressure cell (12) generally includes a metal body having a diaphragm (26), at least one dielectric layer (28, 38) on the diaphragm (26), and at least one thick-film piezoresistive element (34) on the dielectric layer (28, 38) for sensing deflection of the diaphragm (26). For purposes of compatibility with a wide variety of media, the metal body is preferably formed of steel, most preferably a stainless steel alloy such as an AISI Type 300 or 400 Series. The diaphragm (26) can be formed by etching or machining the metal body. The dielectric layers (28, 38) are preferably formed by thick-film processing as done for the piezoresistive element (34), employing materials that will adhere to the metal diaphragm (26), withstand the strains induced as the diaphragm (26) deflects, and faithfully transmit such strains to the thick-film piezoresistor (34).

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Indianapolis, IN, United States of America

Joseph M Ratell