International Business Machines Corporation

Applied Materials, Inc.

Joseph M Danza

Laertis Economikos

Gopalakrishna B Prabhu

Fen Fen Jamin

Joseph F Salfelder

Donald J Delehanty

Daniel M Heenan

Wayne R Swart

Srinivas R Mirmira

A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.

Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers

Growing community of inventors

Newburgh, NY, United States of America

Joseph M Danza