General Electric Company

Joseph Lucian Smolenski

Vadim Bromberg

Carlos H Bonilla

Victor Fulton

Richard Alfred Beaupre

John Thomas Sterle

Younkoo Jeong

Tyler Andrew Griffith

Harry Kirk Mathews, Jr

John Stanley Glaser

Timothy Francis Andrews

Peter Douglas Lueschen

Eugene Pauling Boden

Kwok Pong Chan

Xiaolei Shi

Mary Kathryn Thompson

Brian Lee Lawrence

Walter Whipple

Pingfan Peter Wu

Marc Dubois

Rixin Lai

Xiaochun Shen

Ruben Egberto Fairman

Jacob Mayer

Ertugrul Berkcan

William James Premerlani

Jerome Johnson Tiemann

William Dwight Gerstler

Hendrik Pieter Jacobus De Bock

Peter Almern Losee

Eugene George Olczak

Eladio Clemente Delgado

Michael Joseph Schutten

Rui Zhou

Aaron John Avagliano

Daniel Qi Tan

Austars Raymond Schnore, Jr

Michael Richard Durling

Aditya Kumar

Josef Robert Unternahrer

Emilie Thorbjorg Saulnier

Danijel Maricic

David Lawrence LeMieux

Travis Gene Sands

Lili Zhang

Glen Charles Fedyk

Adam Gregory Pautsch

George Charles Goodman

Russell Stephen DeMuth

Jeffrey S Sullivan

Jinhui Zhang

Erwin Wenti Liang

Allan John Connolly

Brian Harlow Farrell

Teeporn Paul Tanpitukpongse

Alfred E Relation

Eric Redito Robrigado

John C Wright

Gerard W Christopher

Robert Butler

Additive manufacturing apparatuses, components of additive manufacturing apparatuses, and methods of using such manufacturing apparatuses and components are disclosed. An additive manufacturing apparatus may include a recoat head for distributing build material in a build area, a print head for depositing material in the build area, one or more actuators for moving the recoat head and the print head relative to the build area, and a cleaning station for cleaning the print head.

Additive manufacturing apparatuses and methods

A method for forming an object includes moving a recoat assembly () in a coating direction over a build material, wherein the recoat assembly () comprises a first roller () and a second roller () that is spaced apart from the first roller; rotating the first roller () of the recoat assembly in a counter-rotation direction, such that a bottom of the first roller moves in the coating direction; contacting the build material with the first roller of the recoat assembly, thereby fluidizing at least a portion of the build material; irradiating, with a front energy source () coupled to a front end of the recoat assembly, an initial layer of build material positioned in a build area; subsequent to irradiating the initial layer of build material, spreading the build material on the build area with the first roller, thereby depositing a second layer of the build material over the initial layer of build material; and subsequent to spreading the second layer of the build material, irradiating, with a rear energy source () positioned rearward of the front energy source, the second layer of build material within the build area.

Recoat assemblies for additive manufacturing systems and methods for using the same

Additive manufacturing apparatuses are disclosed. In one embodiment, an additive manufacturing apparatus may comprise a support chassis including a print bay, a build bay, and a material supply bay. Each bay may comprise an upper compartment and a lower compartment. A working surface may separate each of the print bay, the build bay, and the material supply bay into the upper compartment and the lower compartment, wherein: the build bay may be disposed between the print bay and the material supply bay. The lower compartment of the build bay comprises bulkheads sealing the lower compartment of the build bay from the lower compartment of the print bay and the lower compartment of the material supply bay.

Additive manufacturing apparatuses and methods for using the same

A binder jet printing apparatus (), along with methods of its use, is provided. The binder jet printing apparatus () may include: a job box () having a actuatable build plate () therein; a supply box () having a bottom platform () that is actuatable within the supply box (); a print system including at least one print head () connected to a binder source () and configured to apply a pattern of binder onto an exposed powder layer () over the build plate () of the job box (); a recoat system () including a recoater configured to move from the supply box () to the job box () to transfer powder from the supply box () to the job box () so as to form a new powder layer () over the build plate () of the job box (); and a cure system () configured to direct electromagnetic radiation onto the job box ().

Binder jetting apparatus and methods

A power converter is provided. The power converter includes a first phase including a first upper diode and a first lower diode, a second phase including a second upper diode and a second lower diode, a third phase including a third upper diode and a third lower diode, a plurality of MOSFETs, each of the first upper diode, the first lower diode, the second upper diode, the second lower diode, the third upper diode, and the third lower diode electrically connected in parallel with a respective one of the plurality of MOSFETs, and a control system configured to selectively activate each MOSFET when current flows through a diode electrically coupled in parallel with that MOSFET.

Systems and methods for synchronous power conversion

A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components. The system further includes a heat transfer assembly coupled to the at least one inner wall and configured to facilitate operating the plurality of second electronic components below the second normal operating maximum temperature by transferring heat from the inner zone to the outer zone.

System and method for power electronics with a high and low temperature zone cooling system

A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

Film capacitor and the method of forming the same

A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

Cooling device for a power module, and a related method thereof

Systems and methods for an electric choke are provided. The choke may be provided as part of a power transmission arrangement that includes a cable for electrically coupling a power source and a powered device having a ground node and a wire separate from the cable providing a path for a common-mode current through the ground node. The power transmission arrangement also includes an unbalanced choke coupled between the power source and the powered device, wherein a number of turns of the cable in the choke is different than a number of turns of the wire in the choke.

Systems and methods for providing an electric choke

A method for storing data including: providing a first substrate having a plurality of micro-holograms therein, the micro-holograms being indicative of the data; providing a second hologram-supporting substrate; illuminating the plurality of micro-holograms in the first substrate through the second substrate, thereby producing a holographic pattern in the second substrate indicative of reflections of the plurality of micro-holograms in the first substrate; providing a third hologram-supporting substrate; and, illuminating the holographic pattern in the second substrate through the third substrate, thereby substantially replicating the plurality of micro-holograms in the first substrate in the third substrate.

Data storage method and device

A busbar for power conversion applications that includes two planar conductors that have terminal locations; a first planar insulator located between the planar conductors; two impedances elements that are electrically connected to each of the planar conductors, wherein the impedance elements each extend in a plane that is non-coplanar from the planar conductors, further wherein the impedance elements are configured so as to define a gap between them; and a second planar insulator is located in the gap. A power conversion assembly that connects an energy source and a power switch to the busbar.

Busbar for power conversion applications

An electric machine drive system is described. The system includes an inverter, an electric machine coupled to the inverter by at least one output conductor and including a ground connection, and an active common mode current reducing device coupled between the ground connection of the electric machine and the inverter.

Systems and apparatus for reducing electromagnetic interference and methods of assembling the same

A power-converting apparatus, such as a power module, may include a base plate (), a first direct current (DC) bus and a second DC bus (). A power semiconductor component () may be electrically coupled to one of the buses, and may be disposed on a substrate () physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor () may be coupled across the first and second DC buses, and at least second and third capacitors () may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path. Capacitors () may each be located inside the power module to establish circuit connections sufficiently proximate to the first power semiconductor component to reduce a formation of parasitic inductances, and further may each be located physically apart from the substrate and thus not exposed to the heat flux.

Power converting apparatus having improved electro-thermal characteristics

A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Insulated metal substrates incorporating advanced cooling

Growing community of inventors

Slingerlands, NY, United States of America

Joseph Lucian Smolenski