International Business Machines Corporation

Joseph Kuczynski, Jr

Jing Zhang

Jason T Wertz

Dylan J Boday

Melissa K Miller

Heidi D Williams

A method comprising injection molding a plastic part from a polymer formulation comprising an injection moldable thermoplastic and a fluorescent compound, wherein the fluorescent compound has a decomposition temperature that establishes a maximum processing temperature for the polymer formulation. The fluorescent compound will thermally decompose to generate gaseous products causing visible bubble formation in the surface of the plastic part in response to exposure to a processing temperature that exceeds the decomposition temperature of the fluorescent compound. If the plastic part was processed without exposure to a processing temperature that exceeds the decomposition temperature of the fluorescent compound, then any fluorescent compound within the plastic part will cause the plastic part to fluoresce in response to exposure to black light. A suitable fluorescent compound may be, for example, selected from oxalates, carbamic acids, carbonic acids, diazocarbonyl compounds, and combinations thereof. A preferred fluorescent compound is bis(2,4,6-trichlorophenyl)oxalate.

Fluorescent compounds for detecting use of proper plastic molding temperatures

A method and structures are provided for implementing hose-to-barb connections for water cooling hoses. The water cooling hose is assembled with a barbed fitting to create an interface free joint between a hose material and the barbed fitting. The hose material contains microcapsules which contain a catalyst and/or a combination of microcapsules which contain monomer and catalyst in separate microcapsules that promote polymerization when ruptured. The hose material contains functional groups that can be polymerized with a functionality that is contained on the hose surface. This process creates a secure interface free covalent bond, thus preventing leaks from occurring.

Implementing interface free hose-to-barb connection

A method and circuit for implementing data theft prevention, and a design structure on which the subject circuit resides are provided. A polymeric resin containing microcapsules surrounds a security card. Each microcapsule contains a conductive material. The conductive material of the microcapsule provides shorting on the security card responsive to the polymer resin and the microcapsule being breached, and a data theft prevention function using the shorting by the conductive material to prevent data theft.

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Rochester, MN, United States of America

Joseph Kuczynski, Jr