Raytheon Technologies Corporation

United Technologies Corporation

Joseph Jalowka

James Olaf Hansen

John D Riehl

Jesse C Meyer

Raymond P Martina

Peter Finnigan

Cristal Chan

The present disclosure provides methods and systems for the bonding of dissimilar substrates. For example, a first substrate may be coupled to a second substrate by a composite joint between the first substrate and the second substrate. The composite joint may be comprised of a first adhesive material and a second adhesive material. The first adhesive material may be disposed on the first substrate, and the second adhesive material may be disposed to the first adhesive material. The composite joint between the first substrate and the second substrate may provide an isolation layer therebetween, preventing galvanic corrosion.

Systems and methods for bonding of dissimilar substrates

A method for making a composite article comprises securing a layup over a form. The layup including a plurality of dry intermediate reinforcement plies wrapped around an inner reinforcement ply. Resin is infused into the layup under vacuum. The resin-infused layup is consolidated under pressure and cured.

In-situ pressure enhanced processing of composite articles

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Broad Brook, CT, United States of America

Joseph Jalowka