Cisco Technology, Inc.

Fujitsu Network Communications, Inc.

Joseph Jacques

Edward John Kliewer

Vic Hong Chia

Hiep Xuan Nguyen

Gary Chan

John Scott Scheeler

Hai Ho

Harrison S Teplitz

Osvalso Garcia

A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.

Split enclosure for fan-less cooling

A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

Incorporating heat spreader to electronics enclosure for enhanced cooling

In order to increase the flexibility of the positioning of a stacked computer system within a data center, a removable fan unit is positioned within the computer system. The removable fan unit includes a fan housing that supports a fan electrically connected to a connector extending from a side of the fan housing. The connector of the removable fan unit may be electrically connected to a computer system-side connector in a first orientation to move air through the computer system in a first direction. The connector or another connector of the removable fan unit may be electrically connected to another or the same computer system-side connector in a second orientation to move air through the computer system in a second direction.

Configurable fan unit

A voltage regulator is configured to receive an input voltage from a power supply, measure a temperature associated with a heat transfer medium, produce an output voltage to drive a thermo-electric cooler, and vary the output voltage in accordance with changes in the measured temperature. Varying the output voltage results in: 1) extracting of heat from the heat transfer medium when the measured temperature is above a threshold value, or 2) supplying of heat to the heat transfer medium when the measured temperature is below a threshold value. The voltage regulator can cap upper and lower bounds of the output voltage to prevent the thermo-electric cooler from reaching its saturation point. The voltage regulator can be configured to produce an output voltage having reduced voltage ripple.

Thermal pump module and temperature regulation

Techniques for cooling electronics assemblies are provided. A divider, such as an electronic card, is utilized to define flow channels through the chassis of the electronics assembly. The divider is parallel to the electronic cards and air movers, such as fans, can be utilized in a push-pull configuration to cause air to flow and counter-flow through the flow channels to cool the electronic cards.

High efficiency counter-flow shelf cooling system

Metal spring gaskets for EMI shielding in linecard plug-in units are improved by coverings of conductive fabric adhered to the springs with conductive adhesive.

Growing community of inventors

Austin, TX, United States of America

Joseph Jacques