International Business Machines Corporation

Joseph Jacobi

Charles Leon Arvin

Shidong Li

Thomas Edward Lombardi

Mark William Kapfhammer

Bhupender Singh

Joseph C Sorbello

An integrated circuit package structure is provided that includes a chip carrier substrate, at least one processor die provided on the chip carrier substrate, a plurality of lateral escape wiring lines connected to and extending away from the at least one processor die, and a plurality of chips at least partially surrounding the processor die, at least one of the chips overlapping with at least one of the lateral escape wiring lines in a plan view. An interconnect structure of the chips includes at least one vertical power feed structure that is configured and positioned not to intersect with the lateral escape wiring lines in the plan view.

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Hopewell Junction, NY, United States of America

Joseph Jacobi