Alliedsignal Inc.

Allied Corporation

Uop Lcc

Joseph J Zupancic

Raymond John Swedo

Andrew M Zweig

Jeffrey P Conrad

James A Wrezel

Howard A Fraenkel

Sandra L Petty-Weeks

Daniel C Blazej

Jean M Frechet

Roger Y Leung

Stephen T Gonczy

Ming S Shum

Anthony J Polak

Jiri D Konicek

Donald R Jamieson

Aroon Vishwanath Tungare

Jeffery P Conrad

Elaine F Schumacher

Allyson J Buehler

Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.

Solvent free epoxy resin compositions containing substituted

Carbon-containing black glass compositions of matter having the empirical formula SiC.sub.x O.sub.y and derived from the polymer precursors having the residue ##STR1##

Carbon-containing black glass monoliths

A curing agent for epoxy resins having improved solubility characteristics has the formula ##STR1## where R is --CH.sub.2 C.sub.6 H.sub.4 X or --CH.sub.2 CH.sub.2 C.sub.6 H.sub.4 X, and X is either --H, --CH.sub.3, --OCH.sub.3, --OH, or --NY, and where Y is --H or CH.sub.3. Such substituted cyanoguanidines are soluble in various solvents and do not require the use of undesirable solvents necessary with cyanoguanidine (dicyanodiamide) itself.

Substituted cyanoguanidines as curing agents for epoxy resins

A carbon-containing black glass has the empirical formula SiC.sub.x O.sub.y wherein x ranges from about 0.5 to about 2.0 and y ranges from about 0.5 to about 3.0 and is resistant to oxidation up to a temperature of about 1400.degree. C. The black glass is synthesized by heating a spirosiloxane polymer in a non-oxidizing atmosphere up to a temperature in the range of from about 750.degree. C. to about 1400.degree. C. The polymers are synthesized by reacting the spirosiloxane oligomers: ##STR1## wherein a and b are integers from 0 to 20, preferably 1 to 5, c and d are integers from 2 to 20, preferably 2 to 6, m is an integer from 0 to 10, preferably 0 to 4, and wherein for each silicon atom in the oligomer having R and R' moieties, R is independently selected from the group consisting of alkyl groups from C.sub.1 to C.sub.20, preferably C.sub.1 to C.sub.5, and R' is independently selected from the group consisting of hydrogen, and alkenyl groups from C.sub.2 to C.sub.20, preferably from C.sub.2 to C.sub.5. The black glass may be used to make moldable complex shapes, filled monoliths, fibers, fiber-reinforced matrix composites, and coatings for substrates such as ceramics, polymers, and carbon-carbon composites.

Silicon carboxide ceramics from spirosiloxanes

This invention relates to an improved, high-yield process for producing cyclic siloxane in a biphasic reaction solvent mixture comprising an alkane, an alcohol and water.

Process for the preparation of cyclic siloxane

A predetermined pattern of a dielectric polymer is formed on a substrate from a mixture of prepolymers which are the ethers of the oligomeric condensation product of (a) dihydric phenol and formaldehyde and (b) a dialdehyde and 3 to 4 moles of a phenol.

Photodefinable interlevel dielectrics

A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the oligomeric condensation product of a dihydric phenol and formaldehyde having the formula ##STR1##

Method of forming a polymer on a substrate

A predetermined pattern of a dielectric polymer is formed on a substrate from a mixture of prepolymers which are ethers of the reaction products of (a) a dicyclopentadiene and a phenol and (b) a dialdehyde and 3 to 4 moles of a phenol.

A class of di-ortho-substituted bismaleimides undergo uncatalyzed Michael addition with polyhydric phenols to afford chain-extended bismaleimides having a significantly wider processing window than the non-extended parent. The fully cured resins show improved fracture toughness, generally have comparable or superior dielectric constant and dielectric loss, and show no degradation in other properties such as resistance to moisture, to methylene chloride, and coefficient of thermal expansion.

Polyhydric phenol chain extenders for certain bismaleimide resin

A predetermined pattern of a dielectric polymer is formed on a substrate from a prepolymer which is an ether of the reaction product of a dicyclopentadiene and a phenol.

APO-BMI is a chain-extended with certain diamines to provide thermosetting resins retaining the improved properties of APO-BMI resins, but having increased toughness in the cured resins.

Ortho-ortho aramatic bis maleimide-diamine resin

The amount of carbon monoxide or oxygen in a gas is measured by determining the change in dielectric properties of a polymer film disposed between two electrodes. A preferred polymer film comprises an organometallic gas carrier interdispersed within an interpenetrating polymer network matrix.

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Bensenville, IL, United States of America

Joseph J Zupancic