Autosplice, Inc.

Interplex Industries, Inc.

Joseph J Lynch

Richard Schneider

Robert Martin Bogursky

Craig Kennedy

Giuseppe Bianca

Richard E Schneider

Kenneth Krone

Gregory K Torigian

Vu Phan

Gary L Tomczak

Timothy Stephany

A connector for connection to a substrate for mounting electronic devices. The connector includes a plurality of coupling contacts pivotably disposed within a housing. Each coupling contact is generally H-shaped and defines opposing first and second spaces. The connector also includes one or more mounting contacts partially disposed within the housing. Each mounting contact has a fastening structure joined to a bar section. The fastening structure is adapted for securement to the substrate and the bar section is disposed in a second space of at least one of the coupling contacts.

Electrical connector

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.

Electrical assembly with a multilayer bus board

A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.

Multilayer bus board

Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Discrete solder ball contact and circuit board assembly utilizing same

A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.

Connector with base having channels to facilitate surface mount solder attachment

A unitary metal clip is stamped from a flat strip of sheet metal which is bent to provide two pairs of generally V-shaped fingers which extend upwardly from a base and have opposing apexes. An L-shaped arm also extends upwardly from the base between the pairs of fingers and has a horizontal pick-up tab that is located at a height above the opposing apexes of the fingers. A pneumatic head of an automatic pick and place machine grabs the pick-up tab and removes the clip from a pocket of a supply tape unrolled from a reel. The base of the clip is positioned on a solder pad of a PC board before solder re-flow. The lower edge of the sidewall of an EMI shield may be pressed down to bend the pick-up tab downwardly and squeeze the sidewall between the apexes of the fingers.

Growing community of inventors

East Northport, NY, United States of America

Joseph J Lynch