Other

Varian Associates, Inc.

Joseph H Johnson

John D Mason

Roger D Luke

Lee B Max

Richard McGhee Kight

Gregory D Boggess

A modular poultry automatic injection and spraying apparatus (10) featuring a dual-sensor switch means (41) and a dual-action, fluid-actuated drive means (101) is disclosed. The apparatus has a casing construction (11) including an upper housing (12) mounted on a lower housing (13) such that the lower housing (13), which contains water-sensitive pneumatic logic circuitry (261), can be easily removed prior to cleaning. The casing construction (11) has the additional advantage of allowing substitute upper and lower housings (12, 13) to be interchanged during maintenance and repair. The dual sensor switch means (41) ensures that the injections are performed accurately and consistently. The dual-action, fluid-actuated drive means (101) allows for the simultaneous injection and spraying functions of the apparatus (10) obviating the need for an additional apparatus or separate compressed air signal. The apparatus (10) also features a compressed air flushing system which prevents the switch means (41) from clogging, and periodically flushes contaminants from the lower housing (13), using exhaust from an alarm means (71), which notifies an operator of a complete run. Additionally, a separation means (21) prevents chicks, y missed by the apparatus (10) due to operator error, from mixing with chicks already inoculated by the apparatus (10).

Modular poultry automatic vaccine injection and spray apparatus

The present invention relates to a pistol grip fishing pole stand. The pistol grip fishing pole stand includes a frame means which is designed to be inserted into the ground and provide support for the pistol grip fishing pole stand. The stand also includes a receptacle therewith which is adapted to receive and engage the pistol grip shaped handle of a fishing pole. The pistol grip fishing pole stand permits a fisherman to fish without having to hold a fishing pole.

Pistol grip fishing pole stand

The base-to-emitter bias voltage and current of a high frequency transistor, operating class AB or class A, is derived from a semiconductive bias device consisting of a semiconductive diode junction fed with current from a constant current source to derive a V.sub.BE voltage thereacross which is the bias source voltage. This source voltage is applied across the base-to-emitter junction of the RF transistor via the intermediary of a positive temperature coefficient silicon resistor. The diode and silicon resistor are packaged together for mounting on a heat sink common to the transistor, whereby the transistor is compensated for temperature dependent changes in V.sub.BE and h.sub.FE.

Temperature compensating transistor bias device

A disposable, pre-gel body electrode for short term use has a self-contained electrolyte gel-impregnated pad therein sealed with a cap which minimizes electrolyte dry-out.

Disposable, pre-gel body electrodes

In a radio frequency transistor package, a layer of metallization is deposited on an electrically insulative thermally conductive ceramic substrate member serving as a heat sink. An insular region of the metallization serves as a pad for receiving a transistor die with the collector region of the transistor bonded to the insular region of metallization. The region of the metallization surrounding the pad comprises a ground plane. An apertured ceramic insulative spacer is bonded over the ground plane metallization with the aperture in registration over the transistor. Input, output and a pair of common lead metal strips are bonded to the upper surface of the spacer in generally coplanar configuration. The two common leads extend across the spacer adjacent opposite sides of the aperture in generally tangential relation thereto. The input and output leads are disposed in between the common leads and are interrupted by the central aperture in the spacer. The common leads are electrically interconnected to the ground plane metallization layer via conductive means extending through the aperture in the spacer. The input lead is connected to one of the base or emitter regions of the transistor die via wire bonding leads extending through the aperture in the spacer. The other base or emitter region of the transistor die is connected via parallel wire bonding leads to the surrounding ground plane metallization. The output lead is connected via a set of parallel wire bond leads through the central aperture to the transistor pad.

Growing community of inventors

Sunnyvale, CA, United States of America

Joseph H Johnson