Motorola Corporation

Motorlla, Inc.

Joseph Guy Gillette

Scott G Potter

Sivakumar Muthuswamy

Pradeep Lall

Robert J Mulligan

Barry M Miles

Jesse E Galloway

Scott F Musil

Zane Eric Johnson

An electronic device () includes a keypad () for data entry, a character recognition system (), and a processor (). The keypad () is comprised of one or more keys () and one or more interstitial spaces () located in close proximity to one or more associated keys of the one or more keys (). The one or more interstitial spaces () and the one or more keys () are comprised of a plurality of touch sensitive material (). The user input to the plurality of touch sensitive material () produces one or more activated segments () used by the character recognition system () to create a correlating character ().

Electronic device with user interface capability and method therefor

A method ( ) of pre-caching user interaction elements, includes monitoring motion patterns ( ) with an electronic input device having a gesture recorder and a writing surface using a three-dimensional position of the recorder with respect to the writing surface, analyzing the monitored motion patterns ( ) made while the recorder is off the writing surface to determine if the recorder is approaching a target area at the writing surface ( ), the target area having an associated functionality, and triggering the functionality ( )before contact between the recorder and the target area. The steps are repeated continuously. The analyzing step ( ) determines if the recorder is moving towards the writing surface, and, if so, a two-dimensional location of the recorder with respect to the plane of the writing surface is determined ( ) and a trajectory is defined based upon the location and movement of the recorder off the writing surface. A control area disposed at an endpoint of the trajectory is identified ( ) as the target area to be triggered. Alternatively, a plurality of trajectories between the recorder and a control area is defined based upon recorder location and movement off the writing surface and correlated with the actual trajectory. For the trajectory with the highest degree of correlation, a corresponding control area is defined as the target area to be triggered. Triggering of multiple control areas can be simultaneous or sequential. The method can be used with a variety of systems including an inductive stylus and tablet system and a radio frequency stylus and tablet system.

Method of pre-caching user interaction elements using input device position

A ball grid array (BGA) or chips scale package (CSP) integrated circuit (IC) ( ) is manufactured by first identifying the most unreliable solder ball joints in the IC. These worst case joints, or joints in the vicinity of the worst case joints, are changed in pad dimension and exposed to more ball/bump conductive material than the other more robust joints ( ) in the IC ( ) to create a ball ( ) on a larger pad ( ) that is larger than the normal sized ball ( ). The larger balls ( ) are formed by placing multiple smaller balls ( ) together on a single pad ( ) to form one larger ball ( ) during a reflow operation. The larger ball ( ) improves the overall IC reliability by improving the reliability of the weakest joints in the IC design. In addition, the standoff of both the larger balls ( ) and the smaller balls ( ) are engineered to be substantially equal.

Method and apparatus for extending fatigue life of solder joints in a semiconductor device

A surface mountable flexible interconnect and component carrier (,) for connecting to a main circuit board consists of a flex circuit (,) with solder pads (,) on one side for receiving an electronic component (,). There is an array of solderable pads (,) on the other side of the flex circuit, and each of the pads in the array has a solder bump (,) fused to it. The array of solderable solder pads (,) is electrically connected to the solder pads (,) for receiving the electronic component (,) by means of electrically conductive vias in the flexible film. A rigid carrier (,) is used to hold the flex circuit in position prior to placement on the circuit board. An opening (,) in the rigid carrier is strategically located so that the electronic component can be soldered to the solder pads. One portion of the rigid carrier is attached with a permanent adhesive (,) to the flex directly above the array of solder pads, and another portion of the rigid carrier is adhesively bonded to the flex circuit at a second, remote, location with a temporary adhesive (,). A breakaway tab (,) is situated between the two portions to aid in removing part of the rigid carrier after assembly.

Surface mount flexible interconnect and component carrier

A high density electrical interconnect is achieved by incorporating a flexible circuit (,) that is removably connected to a low insertion force, ball grid array connector (,). The flexible circuit has a plurality of conductive runners (,), and each of the runners has a termination (,). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (,) that has a pattern of pads (,) corresponding to the array on one side. The other side of the substrate has a corresponding array (,) that is electrically connected to the pads by conductive vias. An alignment feature (,) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (,) that provides sufficient compressive force (,) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (,) of the substrate.

Low insertion force array connector for providing a removable high density electrical interconnect to a flexible circuit

A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.

System for providing a removable high density electrical interconnect

A surface mountable flexible interconnect (100) for connecting two electronic subassemblies is constructed from a flexible film substrate (110). Conductive metal runners (120) run along the bottom surface (114) of the substrate and connect an array of solder pads (122), each having an attached solder bump (123), to a second terminal portion (124) located at the second end of the substrate. A rigid sheet of printed circuit board material (130), attached to the top surface of the substrate using a strong adhesive (142), lies directly above the array of solder pads and acts as stress relief mechanism. A slightly tacky temporary adhesive (140) is used to attach the second end of the substrate to the topside (132) of the rigid sheet.

Surface mountable flexible interconnect

An improved leadless semiconductor device package consists of a molded plastic carrier (30) with a plurality of C5 bumps (52) integrally molded into the bottom side of the carrier. The bumps are made of the same plastic as the carrier and are monolithic to the carrier. The C5 bumps are coated with a solderable material (50) so that they can be connected to pads on a PCB with solder paste. The top side of the plastic carrier has a metallization pattern containing a plurality of bond pads (44) that correspond to pads on the semiconductor die, and the bond pads are electrically connected to the C5 bumps by an electrically conductive structure. A semiconductor die (38) is mounted on the carrier top side and electrically connected to the plurality of bond pads, either by wire bonds (54) or by flip chip bonding. C4 bumps (70) can also be molded into the carrier for flip chip attachment.

Molded plastic ball grid array package

A surface mountable flexible interconnect (10) for connecting two circuit board (30, 32) consists of a flex circuit (12) with solderable runners (14) on one side, the runners traversing the flex circuit from one end to the other. There is a solderable pad (16) at the end of each runner, and each solderable pad has a solder bump (18) fused to it. A rigid carrier ring (20) is used to hold the flex circuit in position prior to placement on the PCB. The flex circuit is formed into a U-shaped loop (26), and the loop is aligned to the carrier so that the loop is situated in an aperture (24) in the carrier. The solder pads lie directly under the carrier ring and face away from it. An adhesive (22) bonds the flex circuit to the carrier ring.

Growing community of inventors

Margate, FL, United States of America

Joseph Guy Gillette