Kla Tencor Corporation

Kla Corporation

Joseph Gutierrez

Krishna Rao

Wei Chang

Ramon Olavarria

Amir Azordegan

Prasanna Dighe

Michael D Brain

Ravi Bhagat

Assaf Kantorovich

Jaydeep K Sinha

Craig MacNaughton

Craig Macnaughton

A permission-engine computer system receives a request for electronic access by an equipment supplier to a manufacturing facility of a manufacturer to perform a remote support activity for equipment in the manufacturing facility. The permission-engine computer system routes the request to a plurality of predefined approvers and receives approval of the request from the plurality of predefined approvers. In response to receiving approval of the request from the plurality of predefined approvers, the permission-engine computer system signals a gateway computer system of the manufacturer that the request is approved. The gateway computer system automatically creates a connection between an electronic device in the manufacturing facility and a computer system of the equipment supplier in response to approval of the request. The connection is used for the remote support activity.

Secure remote collaboration for equipment in a manufacturing facility

In some embodiments, a method is performed at a computer system of a manufacturer. The manufacturer operates a manufacturing facility that includes equipment from an equipment supplier. In the method, a request is received for electronic access by the equipment supplier to the manufacturing facility to perform a remote support activity for the equipment. The request is routed to predefined approvers. Approval of the request is received from the predefined approvers. In response to receiving approval of the request from the predefined approvers, a connection is automatically created between an electronic device in the manufacturing facility and a computer system for the equipment supplier. The connection is used for the remote support activity. Upon completion of the remote support activity, the connection is automatically terminated.

A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool.

Determining critical parameters using a high-dimensional variable selection model

A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.

Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control

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Santa Clara, CA, United States of America

Joseph Gutierrez