International Business Machines Corporation

Other

Joseph Gene Sabia

Voya Rista Markovich

Kostas I Papathomas

Joseph Duane Kulesza

Christina Marie Boyko

John M Lauffer

Richard A Schumacher

Issa S Mahmoud

Roy Lynn Arldt

Burtran Joe Cayson

Philip Chihchau Liu

Richard Michael Kozlowski

James Francis Muska

Richard W Carpenter

Darleen Mayo

Cindy M Reidsema

Francis J Bucek

The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

Via fill compositions for direct attach of devices and methods for applying same

Via fill compositions for direct attach of devices and methods of

Via fill compositions for direct attach of devices and method for

Method for applying curable fill compositon to apertures in a substrate

Via fill compositions for direct attach of devices and methods for

The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon. The vias and plated through holes are arranged in groups and patterns which provide some direct connection between the pads and plated through holes, some pads wired to vias on the exposed surface of the film of dielectric material and some vias wired to plated through holes on the surface of the substrate.

Printed circuit board with aligned connections and method of making same

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Norwich, NY, United States of America

Joseph Gene Sabia