International Business Machines Corporation

Joseph G Schaefer

James Gardner Ryan

Erick G Walton

Charles E Boice

Krishna Chaitanya Ratakonda

Sudipta Kumar Ray

Kamalesh K Srivastava

Birendra N Agarwala

Paul A Totta

Arthur Bross

Karl J Puttlitz, Sr

Nicholas G Koopman

Aziz M Ahsan

Adolf E Wirsing

Li-Chung Lee

Joseph H Underwood

Mark F Chadurjian

Brian J Cascarino

David A Gardner

Charles C Stein

An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).

Single pass variable bit rate control strategy and encoder for processing a video frame of a sequence of video frames

System and method are provided for optimally encoding a sequence of video frames using image statistics collected from multiple encoders connected in parallel, each encoder employing a different set of encode parameters. The image statistics are used to select an optimum set of encode parameters for use in encoding the sequence of video frames in a subsequent encode subsystem stage. As an alternative, multiple buffers are connected to the outputs of the multiple, parallel connected encoders, with the encoded stream from the encoder employing the optimum set of encode parameters selected for output as the bitstream of encoded video data.

Multiple parallel encoders and statistical analysis thereof for encoding a video sequence

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

Method of forming dual height solder interconnections

Solder mass having conductive encapsulating arrangement

An alloy for contacting portions of a conductive interconnect layer exposed by an overlying organic insulating layer having apertures therethrough. The alloy contains chromium and titanium, and is formed such that at least 50 atm % of the total content of the alloy is titanium at the alloy-insulating layer interface.

Chromium-titanium alloy

Growing community of inventors

Berkshire, NY, United States of America

Joseph G Schaefer