Materion Gmbh

Technical Materials Inc.

Joseph G Kaiser

Aaron Vodnick

Robert P Willis

Trevor L Goodrich

Alejandro J Lluberes

Kelley Sullivan Mello

A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.

Samarium-silver alloy clad structure for charging terminals and manufacturing method thereof

A tempering process for tempering an aluminum alloy coil includes a first reel-to-reel process including an anneal to solutionize the aluminum alloy followed by a quench, a second reel-to-reel process comprising rolling reduction, and a hardening anneal performed on the aluminum alloy coil. Cladding may be performed during the second reel-to-reel process; or a subsequent reel-to-reel electroplating process may be performed including an alkaline soak clean, an alkaline microetch and seed electroplating, and aqueous electroplating of a contact metal onto the seed electroplating. Electrical interconnect components may be stamped from the tempered and clad or electroplated aluminum alloy coil. The electrical interconnect components may, for example, be connectors, lead frames, or bus bars.

High throughput continuous processing of aluminum alloys for electrical interconnect components

A stiff, lightweight metal laminate includes a first continuous metal layer, a second continuous metal layer, and a reduced density metal core layer disposed between the first and second continuous metal layers. The reduced density metal core layer comprises a core metal and has an average density that is less than the density of the core metal. Planar metallurgical bonds secure the first and second continuous metal layers to the reduced density metal core layer. The metal laminate may be manufactured by press rolling the reduced density metal core layer sandwiched between the two continuous metal layers, after removing or overcoating the native oxide layer on each layer surface that contacts another layer in the metal laminate.

Devices including metal laminate with metallurgical bonds and reduced-density metal core layer

Metal laminate with metallurgical bonds and reduced density metal core layer and method for making the same

Methods of producing composite products formed between at least two different metal structures in a side-by-side configuration are provided. The method includes providing at least two structures made of different materials that are not compatible for welding or conventional cladding processes. A geometric profile is provided in at least one of the edges of the first structure, and a corresponding mirror image of the geometric profile is provided in a corresponding edge of the second structure. The two structures are positioned together so that the profiled edge or edges form a complimentary composite structure and are then solid-phase bonded to form a composite product. The process may be repeated with additional structure at either end of the first or second structure to achieve multiple side-by-side products. The methods and corresponding products provided herein yield edge to edge products suitable for various electrical connection type applications.

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Barrington, RI, United States of America

Joseph G Kaiser