Ashland Oil, Inc.

Joseph G Holehouse

Anil B Goel

Jai H Kyung

Timothy A Tufts

Robert A Grimm

Phyllis L Brusky

Biau-Hung Chang

Kenneth W Barnett

Jeffrey P Jones

Teresa A DeLong

A process for preparing novel composite structures by priming the surfaces of two or more substrates (such as SMC panels, etc.) with an effective amount of an epoxy resin prior to adhering said surfaces together with an adhesive (such as a polyurethane adhesive) wherein said structures have improved high temperature (about 400.degree. F.) tolerance is described.

Oxirane primers for SMC adhesives and bonding method employing same

An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of (I) An epoxy resin component and (II) A hardener component and (III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

Bonding method employing high performance induction curable

Thermoset polymers are prepared by reacting an ethylenically unsaturated resin monomer and a bicyclic amide acetal with a polyisocyanate in the absence or presence of a vinyl monomer. Reaction rates are suitable for effecting RIM processing. The resultant polymers exhibit improved impact resistance. Further variation in physical properties can be achieved through the use of a diol chain extender for the polyisocyanate.

Thermoset polymer compositions

An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of

High performance induction curable two-component structural adhesive

A process for the production of a pressure sensitive adhesive comprising the interaction of a high molecular weight polyol, a polyisocyanate and a small amount of a bicyclic amide acetal wherein the process results in significant improvement in physical properties, e.g., a high degree of adhesive and cohesive strength, is described.

Polyurethane pressure sensitive adhesives for bonding layered structures

A process for preparing menthane diisocyanate by reaction of a terpinyl monoisocyanate with isocyanic acid in a medium which is an excess of isocyanic acid, a polar solvent, or a mixture of solvents which includes a polar solvent in the presence of a catalyst which is a Bronsted acid or a Lewis acid is disclosed.

Preparation of menthane diisocyanate by addition of isocyanic acid to

Isocyanic acid is formed directly from nitric oxide, carbon monoxide and hydrogen by contacting a supported iridium or rhodium metal catalyst at an elevated temperature with a feed stream of said reactants.

Production of isocyanic acid

An aromatic isocyanate is formed directly from an aromatic hydrocarbon, nitric oxide and carbon monoxide by contacting a Group VII or Group VIII metal catalyst at a temperature between 350.degree. and 550.degree. C. with a feed stream of said reactants.

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Columbus, OH, United States of America

Joseph G Holehouse