Amp LLC

Joseph F Merlina

John P Redmond

George Ulbrich

William S Scheingold

Richard M Wagner

Daniel Marshall Andrews

An integrated circuit package for establishing electrical contact with the terminal areas or pads of an integrated circuit chip comprises an insulating substrate having a flat surface in which there are embedded a plurality of electrodeposited conductors. The conductors have inner ends in a chip-receiving zone of the flat surface and have outer end portions which are remote from the chip-receiving zone. The inner ends of the conductors have contact bumps or promontories extending above the flat surface and located such that when a chip is placed on the promontories, they will be against the terminal areas of the chip. The chip can be held against the promontories by a suitable clamping means and contact established with the conductors at their outer ends by suitable connecting means. The device is particularly useful for testing chips prior to their being placed in service. The integrated circuit package is produced by etching depressions in a copper foil, electrodepositing conductors in the depressions and on the surface of the foil while controlling the locations of the conductors by suitable masking, molding the substrate against the foil so that the conductors are embedded in the substrate, and then etching away the copper foil.

Integrated circuit package and manufacturing method

An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural integrity.

Growing community of inventors

Harrisburg, PA, United States of America

Joseph F Merlina