Rohm & Haas Electronic Materials LLC

Shipley Company LLC

Joseph F Lachowski

Michael K Gallagher

Gregory P Prokopowicz

Zidong Wang

Alejo M Lifschitz Arribio

Luis A Gomez

Jonathan D Prange

Alexander Zielinski

Jeffrey M Calvert

Robert L Auger

Robert L Brainard

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Method of enhancing copper electroplating

Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspect, photoresists of the invention can exhibit good photospeeds, such as 100 mJ/cmor less.

Photoresists comprising novolak resin blends

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

Adhesion promoter

Compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices are provided. These compositions and methods are particularly suitable for removing polymer residues from electronic devices following plasma etch processes.

Stripper for electronics

Disclosed are methods for the reduction of defects during the manufacture of electronic devices. Also disclosed are electronic devices having reduced numbers of defects.

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Sutton, MA, United States of America

Joseph F Lachowski