Motorola Corporation

Joseph English

Douglas G Mitchell

George F Carney

Timothy Lee Johnson

Kandis Mae Knoblauch

David Austin

A method of manufacturing a semiconductor component includes depositing a first electrically conductive layer ( ) over a substrate ( ), forming a patterned plating mask ( ) over the first electrically conductive layer, coupling a first plating electrode ( ) to the first electrically conductive layer without puncturing the plating mask, and plating a second electrically conductive layer onto portions of the first electrically conductive layer. A plating tool for the manufacturing method includes an inner weir ( ) located within an outer weir ( ), an elastic member ( ) over a rim ( ) of the outer weir, a pressure ring ( ) located over the rim of the outer weir and the elastic member, and a plurality of cathode contacts ( ) located between the pressure ring and the outer weir. The substrate is positioned between the elastic member and the pressure ring.

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Tempe, AZ, United States of America

Joseph English