Hewlett-packard Development Company, L.P.

Hewlett-packard Company

The Procter Gamble Company

Stmicroelectronics International N.v.

Stmicroelectronics S.r.l.

Stmicroelectronics Gmbh

Joseph Edward Scheffelin

David S Hunt

Mohammad Akhavain

Brian J Keefe

Janis Horvath

Dana Paul Gruenbacher

Simon Dodd

Elizabeth Zapata

Mark E Young

Noah C Lassar

Alfred U Zepeda

David K McElfresh

Paul Mark Haines

Jon J Fong

James W Ring

Christopher J Schultz

Steven Warren Steinfield

Uwe Schober

Dale Dean Timm, Jr

Stephan Gary Bush

Ali Emamjomeh

Hai Quang Tran

Mark A Devries

George T Kaplinsky

Stefan Hubert Hollinger

Peter Janouch

Tofigh Khodapanah

Winthrop D Childers

Faiz Feisal Sherman

Domenico Giusti

David W Swanson

Lawrence H White

Kenneth R Williams

James E Clark

Melissa D Boyd

Steven L Webb

Teck Khim Neo

Dale Timm

Paul David Schweitzer

Dan Dowell

Christopher J Shultz

Timothy James Hoekstra

Larry E Schnebly

Jim Fischer

Mohammad Akhavin

Jefferson Patrick Ward

Donald L Michael

Kenneth J Courian

Jeffrey T Hendricks

Ronald J Ender

Roberto Brioschi

Max Stephen Gunther

Gerald Vincent Rapp

William Scott Colburn

Ernesto A Garay

Gary Douglas Powell

Benjamin H Wood

Frank J Bretl

James H Sykora

Pere Esterri

Robert-Scott Melendrino Lopez

David K Mc Elfresh

Tanya Schneider

Conrad Lepe

Norman E Pawlowski

Rhonda Lynn Wilson

Silam J Choy

Tony S Cruz-Uribe

Kevin E Swier

Mark Andreas Van Veen

Gary G Lutnesky

Daniel Gonzalez Perello

Joseph R Elliot

Craig L Malik

Rafael Ulacia Portoles

Tsuyoshi Yamashita

Joaquim Brugue Garvi

Michael McCulloch Martin

Dave Hunt

Peter R Stokes

Gary Tarver

May F Ho

Martin Diehl

Kan Liu

Ignacio Olazabal

M Jeffery Igelman

Jannik Scheele

Luis Hierro

Shayler M Backlund

John M Herrmann

Joe Elliot

Amy V Liew

Robert Joseph Katon

Frank J Breti

Stanley G Markwell

Steven Webb

Domenco Giusti

Benjamin H Iii Wood

The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.

Support substrates for microfluidic die

Microfluidic delivery systems for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.

Microfluidic delivery system

A method of connecting a cartridge comprising a fluid composition with a microfluidic delivery system is provided. The method includes the steps of: providing a housing comprising electrical contacts, wherein the electrical contacts of the housing are disposed on a first plane; providing a cartridge comprising a reservoir for containing a fluid composition, a die comprising a nozzle, and electrical contacts that are in electrical communication with the die, wherein the electrical contacts of the cartridge are disposed along a second plane that is parallel with the first plane; and connecting the cartridge with the housing by moving the cartridge in a direction parallel with the second plane toward the housing until the electrical contacts of the cartridge are in electrical communication with the electrical contacts of the housing.

Microfluidic delivery cartridges and methods of connecting cartridges with microfluidic delivery systems

A fluid injection module may include a fluid ejection die, a die carrier, a bypass fluid passage in at least one pressure regulator. The fluid ejection die may include nozzle orifices on a front face of the die, first and second fluid passages extending through the die and a microchannel extending from the first fluid passage to the second fluid passage proximate the nozzle orifices to circulate fluid from the first fluid passage to the second fluid passage. Third and fourth fluid passages may extend through the die carrier. The bypass fluid passage may extend from the third fluid passage to the fourth fluid passage while being connected to the first fluid passage and the second fluid passage. The at least one pressure regulator is to induce pressure differential driven fluid flow across the microchannel and across the bypass fluid passage.

Dual regulator print module

A print module may include a printhead die. The printhead die may include a chamber layer having ink chambers and micro-channels formed in the chamber layer. The print module may further include a die carrier including manifold passages through which ink flows to and from the printhead die and dual pressure regulators to flow fluid through the micro-channels of the printhead die.

A print module includes a printhead die, an input regulator to regulate input fluid pressure to the die, and an output regulator to regulate output fluid pressure from the die. A method includes receiving fluid at an input regulator to a print module, creating a fluid pressure differential within the print module between the input regulator and an output regulator, flowing fluid from the input regulator through a printhead die and to an output regulator using the pressure differential, and drawing fluid from the output regulator.

Microfluidic delivery systems and methods for dispensing a fluid composition into the air comprising microfluidic die and at least one heating element that is configured to receive an electrical signal comprising a certain on-time and wave form to deliver a fluid composition into the air.

Method of delivering a dose of a fluid composition from a microfluidic delivery cartridge

A microfluidic fluid delivery device and method. The device includes a reservoir and a transport member. The device includes a microfluidic delivery member including a microfluidic die configured to release a fluid composition from the device. The microfluidic delivery member includes an adapter configured to receive an end portion of the transport member, wherein a capillary passage is formed between the adapter and the transport member. The capillary passage has a largest effective pore size that is smaller than the average effective pore size of the transport member.

Microfluidic delivery system for releasing fluid compositions

One or more embodiments are directed to a microfluidic delivery system that dispenses a fluid. The microfluidic delivery system may be provided in a variety of orientations. In one embodiment, the microfluidic delivery system is vertical so that fluid being expelled opposes gravity. In another embodiment, the microfluidic delivery system is orientated sideways so that fluid being expelled has a horizontal component. In yet another embodiment, the microfluidic delivery system faces downward.

Microfluidic delivery system and method

A microfluidic refill includes a reservoir having a hollow body and an opening; a transport member in fluid communication with the reservoir; and a lid enclosing the opening of the reservoir. The lid is in fluid communication with the transport member. The lid comprises a rigid microfluidic delivery member. The rigid microfluidic delivery member includes a die and electrical traces that are in electrical communication with the die, wherein the electrical traces terminate at electrical contacts, wherein the electrical traces are disposed on only one plane. The die has a fluid chamber in fluid communication with the transport member at an inlet of the fluid chamber and with an orifice at an outlet of the fluid chamber and.

In one example, a datuming system to position a printhead assembly relative to a component external to the printhead assembly includes a first datum on the printhead assembly to establish a first plane, a first line, and a first point and a second datum on the printhead assembly to establish a second plane orthogonal to the first plane, a second line, and a second point.

Printhead assembly datuming

Growing community of inventors

Poway, CA, United States of America

Joseph Edward Scheffelin