Tyco Electronics Corporation

Commscope Technologies LLC

Qorvo Us, Inc.

Commscope Connectivity Spain, S.l.

Commscope Technology LLC

Joseph Edward Geniac

Longinos De Dios

Mark William Neff

William Joseph Peteritas

Kevin John Peterson

Ralph Sykes Martin

Kurt Thomas Zarbock

Kelly M Lear

Jeffrey Miller

Rommel Quintero

Michael Thomas Gromko

Thomas Wojtacki

William J Remaley

Michael G Pacyga

Aurelio J Gutierrez

Thomas Scott Morris

Bobby Gene Ward

Donald Joseph Leahy

Christine Anne Dooley

Richard Walter Speer

Wolfgang Hoelscher

Keith Wayne Hoover

Stephen Scott Herndon

Brian Howard Calhoun

Robert Jeffrey Burwell

Domingo Farias

W Kent Braxton

Kyle Sullivan

Christine Ann Dooley

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

Electromagnetic shields with bonding wires for sub-modules

The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.

Segmented shielding using wirebonds

A metallic contact for insertion into a modular telecommunications plug includes a generally planar body defining a top end, a bottom end, a front end, a rear end, and a length extending from the front end to the rear end. The bottom end is at least partially defined by a blade for piercing an insulation of a wire positioned within the plug. At least a portion of the top end is configured to electrically contact a conductor of a jack that receives the plug. The top end is defined at least in part by a first engagement surface that is separated from a second engagement surface by a notch. An uppermost portion of the first engagement surface defines a first push surface that is generally at the same height as a second push surface defined by an uppermost portion of the second engagement surface. The notch is defined by a front vertical wall spaced from a rear vertical wall, wherein the front vertical wall is positioned at a distance of at least half the length of the contact from the front end of the contact.

Notched contact for a modular plug

A cable includes twisted pairs of insulated conductors. Each twisted pair includes two insulated conductors twisted together in a helical manner. The twisted pairs are grouped together to define a central core of the cable. An inner filler element is wrapped helically around the twisted pairs of the central core. An outer filler element is wrapped helically around the twisted pairs of the central core. The outer filler element is wrapped over the inner filler element.

Cable with twisted pairs of insulated conductors and filler elements

A module assembly includes an interface module including a housing having a plurality of jack cavities and associated jack latch openings. The housing is configured to be mated with a patch panel. The module assembly also includes a plurality of modular jacks that are directly inserted into corresponding jack cavities. Each modular jack includes a single latch arm that engages the jack latch opening to retain the modular jack in the jack cavity. Optionally, each modular jack may include a top surface and a bottom surface, wherein the latch arm extends from the top surface and wherein the bottom surface is planar. The bottom surface may rest flush with a bottom wall of the jack cavity.

Patch panel modular jack assembly

A low-profile cable is provided and includes a body having upper and lower portions that extend a length of the body and also having opposite sidewalls joining the upper and lower portions to one another. The cable also includes passages that are located between the sidewalls. The passages extend the length of the body and are configured to receive at least one twisted pair of conductors. Also, the cable includes a load-bearing structural section that spans between the upper and lower portions. The structural section includes opposing wall supports separated by a pocket channel therebetween. The structural section is configured to support the upper and lower portions and substantially resist deformation of the passages when external forces are induced onto at least one of the upper and lower portions.

Low-profile cable

A connector assembly comprising a cap member having a plurality of fixed cap terminal position assurance mechanisms defined thereon, and a plug member having one or more of fixed plug terminal position assurance mechanisms defined thereon, wherein each of the cap terminal position assurance mechanisms fixably mate with each of the plug terminal position assurance mechanisms, wherein each of the cap and plug terminal position assurance mechanisms comprise a post projecting outwardly from each of the cap member and the plug member, and a cutout configured to fixably mate to the post. The cutout maybe configured adjacent the post, wherein the cap/plug terminal position assurance mechanisms are arranged proximate an outer rim of the cap/plug member or the cap/plug terminal assurance mechanism may be located generally in the center of the interface manifold.

Terminal position assurance with forward interlocking face keying

The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

Modular jack assembly with signal conditioning

Growing community of inventors

Greensboro, NC, United States of America

Joseph Edward Geniac