Eastman-kodak Company

Joseph E Yokajty

Thomas W Palone

James G Rydelek

John K McBride

Steven S Chapman

Daniel C Jackson

David John Nelson

Joseph A Watkins

Todd Russell Griffin

Jinquan Xu

Jeffrey P Serbicki

Michael S Hanchak

David Louis Jeanmaire

Steven A Van Slyke

William J Grande

Michael T Wolf

Thomas A Sisson

Thomas P Melanson

Ronald S Cok

Michael Edgar Long

James Alan Katerberg

Gary Edward Merz

John Charles Brazas, Jr

Zhanjun Gao

Robert J Simon

Thomas Walter Steiner

Randolph Brost

Michael Frank Baumer

James A White

Joseph E Stagnitto

Bradley S Bush

Gopalan Rajeswaran

John C Brazas

Bradley A Phillips

Mark D Fraser

Edward B Richter

Camiel J Raes

Douglas E Schultz

Randal L Mullins

Garry L Wohlschlegel

Steven P Vogel

Kevin P Egan

Matthew Stanzione

A printhead includes a drop generator configured to selectively form a large volume drop and a small volume drop from liquid emitted through a nozzle associated with the drop generator, the large volume drop and the small volume drop traveling along an initial drop trajectory, and a gas flow deflection system including a gas flow that interacts with the large volume drop and the small volume drop in a drop deflection zone such that at least the small volume drop is deflected from the initial drop trajectory, the gas flow being provided by a gas flow source connected in fluid communication with a gas flow duct, the gas flow deflection system including a gas flow pressure oscillation dampening structure located between the gas flow source and the drop deflection zone.

Printhead having improved gas flow deflection system

A continuous liquid printing system gas flow device includes a gas flow duct structure including a first wall and a second wall. The first wall and the second wall are positioned spaced apart and opposite each other to form an opening. The first wall is contoured such that a distance between the first wall and the second wall varies when viewed in a direction perpendicular to the opening.

Continuous printhead contoured gas flow device

In an inkjet printhead using a gas flow, typically air, to deflect select drop into catch, gas flow (air) ducts are employed to direct the air across the drop trajectories. Improved air ducts include liquid flow channels in a wall of the air duct are provided to allow ink to be removed from the air duct without disrupting the air flow in the duct. A process for cleaning the air duct using the liquid flow channel is also provided.

Continuous printhead gas flow duct including drain

A drop generator operable to selectively form a drop having a first size and a drop having a second size from liquid emitted through a nozzle associated with the drop generator. The drop having the first size and the drop having the second size travel along a drop trajectory with the first size being larger than the second size when compared to each other. Each of the drops has a drop velocity. A gas flow deflection system includes a gas flow that is directed at a deflection zone that comprises at least a portion of the drop trajectory. The gas flow in the deflection zone includes a velocity vector having a parallel velocity component and a perpendicular velocity component with the parallel velocity component and the perpendicular velocity component being defined relative to the drop trajectory.

Printer having improved gas flow drop deflection

A method of bonding a cover plate over OLED devices formed on a surface of a device substrate wherein each one of the OLED devices includes at least one electrical interconnect area includes providing a flow-preventing pattern on a surface of the cover plate or on the OLED devices absent from the electrical interconnect areas of the OLED devices to prevent flow of a flowable adhesive material into at least the outermost portions of such interconnect areas; dispensing a selected amount of a flowable curable adhesive material on the surface of the cover plate in registration with the flow-preventing pattern; engaging the cover plate in alignment with the substrate; and curing the adhesive material.

Method of making an OLED display device with enhanced optical and mechanical properties

A method of bonding a common cover plate over a plurality of OLED devices formed on a device substrate includes providing an unpatterned or a patterned layer of a pressure-sensitive adhesive (PSA) material over a surface of the cover plate; bonding the cover plate over the OLED devices; and singulating individual OLED devices having a bonded cover plate and permitting electrical access to electrical interconnects associated with each OLED device for attaching electrical leads thereto.

Method of fabricating a cover plate bonded over an encapsulated OLEDs

An integrated touch screen and OLED flat-panel display includes a touch screen having a touch screen substrate with electrical contacts for receiving touch screen signals and conductive vias through the substrate and electrically connected to the electrical contacts; an OLED flat-panel display having a display substrate with electrical contacts for receiving display signals and an exposed area on the display substrate for providing electrical connection to the electrical contacts of the display and the touch screen; and wherein the touch screen substrate is the cover or substrate of the OLED flat-panel display, the conductive vias are electrically connected to conductors and electrical contacts located on the display substrate, and the substrate of the OLED flat-panel display protrudes beyond the cover to provide electrical connection to the electrical contacts of the display and touch screen.

Integrated touch screen and OLED flat-panel display

A method for making a shadow mask array is taught. Producing a plurality of shadow mask sections; inspecting the plurality of shadow mask sections to determine which shadow mask sections are acceptable as meeting predetermined criteria; positioning a predetermined number of the acceptable mask sections into predetermined locations relative to one another to form a mask section array thereby distributing any error in individual mask sections across the mask section array; and attaching the individual mask sections of the mask section array to a support structure. The support structure allows for expansion and/or contraction of the individual mask sections of the mask section array while maintaining relative positioning of the individual shadow mask section in the shadow mask array. The support structure further allows for compliance of the shadow mask array in a direction normal to the plane of the shadow mask array thereby allowing for a substantially planar interface between the shadow mask array and a substrate to be coated.

Method and apparatus for making a shadow mask array

An apparatus for uniformly distributing parts on a conveyor surface which includes a storage bin for holding randomly oriented parts in bulk, a conveyor adjacent the storage bin for acquiring a fragment of the randomly oriented parts in the storage bin and delivering that fragment of randomly oriented parts to a chute, a vibratory conveyor receiving the fragment of randomly oriented parts from said chute, and a belt conveyor for receiving the randomly oriented parts from said vibratory conveyor. The vibratory conveyor includes at least one rib projecting upward therefrom and extending across at least a section of the vibratory conveyor perpendicular to the direction of conveyance, the at least one rib acting as a flow obstruction to cause the randomly oriented parts traveling on the vibratory conveyor to gather and spread across a width of said vibratory conveyor to thereby spread more uniformly on the vibratory conveyor after passing over the at least one rib.

Apparatus to uniformly distribute bulk conveyed parts for inspection by a camera

A fabricated wafer incorporates features suitable for integration in a multiple wafer structure. Such a wafer has a predetermined pattern formed therein comprising components for use in the multiple wafer structure and a plurality of locating features generally surrounding the predetermined pattern for cooperating with a mechanical aligning fixture.

Fabricated wafer for integration in a wafer structure

Conveyor for uniformly distributing parts

An actuating device is taught for use with a robotic arm having a linear actuator which includes an actuated portion and a stationary portion with a tool device supported by the actuated portion. The actuating device includes a bracket attached to the stationary potion of the linear actuator with bracket presenting an engaging surface. There is a mechanical assembly for controlling rotation of parts acquired by the tool device which is attached to the actuated member of the linear actuator of the robotic arm. The mechanical assembly includes a displacement linkage member and a rotatable subassembly. The displacement linkage member contacts the engaging surface when the mechanical assembly is raised to a predetermined height through operation of the linear actuator portion. By raising the mechanical assembly above the predetermined height, the displacement linkage member is caused to drive rotation of the rotatable subassembly. A spring is provided to normally bias the displacement linkage member to a home position.

Rotating jaw robotic gripper

A magnetic orientation process has been developed for the assembly of additional features to film cartridges to minimize the impact of the existing manufacturing process. This process orients the assembled film cartridge after it has been inserted into the packaging canister allowing an exposed film indicator to be added to the cartridge after it has been fully assembled and inserted into the canister. The orientation process uses magnetics to consistently orient the cartridge in the canister for subsequent assembly operations.

Magnetic orientation process and device

A method of registrably aligning wafers prior to bonding uses an assembly jig having a plurality of upstanding aligning elements each of which is arranged to registrably align with one of a predetermined number of locating features of the wafers. The locating features of the wafers are arranged about a corresponding upstanding aligning element of the jig prior to bonding the wafers.

Method of registrably aligning fabricated wafers preceding bonding

Growing community of inventors

Webster, NY, United States of America

Joseph E Yokajty