W. L. Gore & Associates, Inc.

Gore Enterprise Holdings, Inc.

Joseph E Korleski, Jr

David R King

Peter J Roeber

Kenneth R Newcomb

John Streeter

Sherif A Eskaros

Lonzo C McLaughlin

Michael Houghton

Alex R Hobson

Brian C Lentz

Carey V Campbell

Jeffrey C Towler

James William Mann

David Robert King

Alfred A Alpini

Paul J Fischer

Joseph G Ameen

William P Mortimer, Jr

Victor P Yokimcus

Michelle M Waters

Gary C Adler

A non-shortening catheter balloon having a longitudinal axis and an inflatable balloon able to be affixed to a catheter shaft is provided. The balloon has an uninflated length which remains relatively unchanged upon inflation and is formed of least two helically oriented wrapped passes of balloon materials at a balanced force angle. Methods of making this balloon are also provided.

Non-shortening wrapped balloon

The present invention provides a stretchable material suitable for use in an inflatable medical device. The stretchable material has at least one reinforcing polymer layer with a top and bottom side forming a porous matrix which is imbibed with a sealing material to infiltrate and substantially seal spaces of the porous matrix and extend beyond the reinforcing polymer layer to form a surface coating.

Inflatable imbibed polymer devices

A catheter balloon with integral non-distending regions having a plurality of layers which wind around the balloon material and overlap to form an angle of between 45 and 90 degrees relative to each other upon inflation, and methods of making the non-distending regions are provided.

Catheter balloons with integrated non-distensible seals

An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature T greater than 200&deg; C. and a volumetric coefficient of thermal expansion of &lE;75 ppm/&deg; C. A semiconductor device is electrically attached to the laminated substrate.

Electronic chip package

A method of preparing an adhesive composite is provided where a fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate vapor phase formed inorganic filler having uniform surface curvature, sufficient adhesive and filler are present to provide a composite having between about 5 to about 40 volume percent polymeric substrate, 10-95 volume percent adhesive and filler imbibed within the voids of said substrate and 5 to 85 volume percent inorganic filler is contained within the composite. In the composite, the ratio of mean flow pore size to largest particle size is at least above 0.7; or the ratio of mean flow pore size to average particle size is greater than 1.5; or the ratio of minimum pore size to average particle size is at least above 0.8; or the ratio of minimum pore size to largest particle size is at least above 0.4.

Adhesive-filler film composite

A method of preparing an adhesive composite is provided where a expanded fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate inorganic filler, sufficient adhesive and filler are present to provide a composite containing between about 5 to about 40 volume percent expanded fluoropolymer; 5-85 volume percent inorganic filler; and 10-95 volume percent of adhesive and filler, the adhesive and filler being contained within the voids of the expanded fluoropolymer. In the composite, the ratio of the mean flow pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 2 and/or the ratio of the minimum pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 1.4 within the composite.

Process for making an adhesive-filler polymer film composite

An adhesive composite material comprises an expanded fluoropolymer with nodes and interconnected fibrils, the fluoropolymer having a void volume which is at least partially filled with a mixture containing a thermoset or thermoplastic adhesive and a particulate inorganic filler. The composite material contains sufficient adhesive and filler such that the composite contains between about 5 to about 40 volume percent expanded fluoropolymer; 5-85 volume percent inorganic filler; and 10-95 volume percent of adhesive and filler, the adhesive and filler being contained within the voids of the expanded fluoropolymer. In the composite, the ratio of the mean flow pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 2 and/or the ratio of the minimum pore size of the expanded fluoropolymer to the largest particle size of the filler is at least about 1.4.

Adhisive-filler polymer film composite

The present invention is an improved adhesive sheet (also known as a 'bond ply,' 'bond film,' or 'prepreg') material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.

Matched low dielectric constant, dimensionally stable adhesive sheet

The present invention relates to thin adhesive composite films formed from fluoropolymers imbibed with adhesives and containing a filler at least within the infra-structure of the polymer to provide the film with a high dielectric constant. The films of the present invention are particularly suitable for use in a capacitor or in applications requiring high capacitive properties.

High capacitance sheet adhesives

A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive particles attached to solid portions thereof. The interface has numerous benefits over previously available material, such as improved thermal conductivity, high conformability, better compressibility, inherent porosity so as to provide air relief, improved stress relief, and high material compliance and resistance to fatigue during thermal cycling.

Thermally conductive adhesive interface

A porous composite sheet is prepared from a mixture of polytetrafluoroethylene particulates and liquid crystal polymer particulates. The liquid crystal polymer in the porous composite sheet can be in the form of particulates contained within a polytetrafluoroethylene microstructure, or formed into a network of liquid crystal polymer fibers contained within and attached to the polytetrafluoroethylene microstructure. The porous composite sheet can be used as a self-reinforced porous sheet, for example, as a filter media. The pores of the composite sheet can be at least partially filled with polymeric resins and the composite sheet laminated to form useful electronic assemblies such as printed circuit boards and the like.

Growing community of inventors

Newark, DE, United States of America

Joseph E Korleski, Jr