Rogers Corporation

Joseph E Johnston

Raymond C Jodoin

Donald P Schilling

Scott S Simpson

William P Harper

Richard T Traskos

Cathy A Fleischer

Inductive devices, i.e., transformers, coils, inductors, etc. are produced from a rolled flexible circuit. The flexible circuit is comprised of a dielectric substrate having a circuit pattern thereon. The circuit pattern is configured such that, upon rolling, one or more coils is formed thereby defining an inductor, transformer, etc. Additionally, these inductive devices may be easily shielded using a ground plane in the flexible circuit. The rolled flexible circuit may be secured in several ways including an adhesive or by using a thermoplastic bonding layer which acts to heat seal the circuit together. The inductive devices of the present invention may be wrapped or rolled about a permeable core which improves inductance. Inductor devices manufactured in accordance with the present invention have the advantages of being small, surface mountable, inexpensive to manufacture and being capable of insertion onto printed wiring boards using automated insertion equipment. The small size of the inductor devices permit the present invention to take up only small areas on the circuit board thereby conserving valuable 'real estate' on the printed wiring board.

Inductive devices for printed wiring boards

A time delay device for adjusting the arrival time of an electronic signal at a specific area in a circuit pattern is presented. The time delay device is comprised of a coplanar flexible circuit having a conductive pattern consisting of a signal line in a ground shield. The signal line is preferably serpentine and makes one or more passes back and forth on the dielectric surface of the flexible circuit. The ground plane covers substantially the entire surface of the laminate except for a small gap on either side of the signal line. This circuit laminate is then tightly rolled up and permanently packaged in a suitable sheath or by encapsulation. The delay of the delay line is substantially increased (without increasing the line length of the circuit) by utilizing a dielectric and/or adhesive having high permeability. The use of a high permeability dielectric and/or adhesive will minimize the size, cost and resistive losses of the time delay device.

High permeability rolled delay line of the coplanar type

A time delay device for adjusting the arrival time of an electronic signal at a specific area in a circuit pattern is presented. The time delay device is comprised of a coplanar flexible circuit having a conductive pattern consisting of a signal line in a ground shield. The signal line is serpentine and makes one or more passes back and forth on the dielectric surface of the flexible circuit. The ground plane covers substantially the entire surface of the laminate except for a small gap on either side of the signal line. This circuit laminate is then tightly rolled up and permanently packaged in a suitable sheath or by encapsulation.

Rolled delay line of the coplanar line type

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed from a lead frame which contains the four leads of the capacitor (two of which are electrically inactive) on a single plane. The use of a lead frame automatically provides the dimensional tolerances necessary for encapsulation molding of the decoupling capacitor. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a multilayer monolithic ceramic capacitor (for higher capacitance values in combination with other desirable properties such as flat capacitance vs. temperature characteristics), active leads bonded to the capacitor and dummy pins for auto-insertion into printed circuit boards.

Decoupling capacitor and method of manufacture thereof

A flat decoupling capacitor having incorporated therein a multilayer chip capacitor which provides high capacitance values, local charge storage and noise decoupling for integrated circuits is presented. The decoupling capacitor essentially comprises at least two conductors electrically connected to a multilayer ceramic capacitor chip, all of which are encapsulated by an insulating material. Several embodiments are described having variations in chip dimensions, number of multilayer capacitors, number of conductors and particular structural configuration. A simplified embodiment and method of manufacture thereof is also presented.

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Chandler, AZ, United States of America

Joseph E Johnston