Corning Incorporated

Philips Electronics North America Corporation

North American Philips Corporation

Other

U.S. Philips Corporation

Joseph E Canale

Henrikus J Pragt

Bart Van Der Leeuw

Thomas W Morris

Gary Richard Trott

Jeffrey Stapleton King

Stephen L Cooch

Albert E Kowal

Clayton L Tuttle, Ii

John P Dunn

Norman R King

William L Haynes

J Mario Quintal

William R Narby

The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Glass wafers for semiconductors fabrication processes and methods of making same

Glass wafers for semiconductor fabrication processes and methods of making same

Disclosed is a method for sealing and affixing a component assembly for an electrical lighting device to a glass lamp envelope. The assembly used in the process comprises the component, such as an electrode lead wire and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300&#xb0; C. in the range of 30&#x2013;45&#xd7;10&#xb0; C..

Sealing lighting device component assembly with solder glass preform by using infrared radiation

Disclosed are a component assembly for an electrical lighting device and method for sealing the same. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The component assembly is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing damage to other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300&#xb0; C. in the range of 30&#x2013;45&#xd7;10&#xb0; C..

Component assembly with solder glass preform for lighting device and sealing process

The high pressure discharge lamp has a quartz glass lamp vessel having two opposite pinch seals. The pinch seals have major faces which are tapering from an end face towards the discharge space and have raised ridges along their axial edges. The height of the ridges diminishes towards the end faces. The lamp vessel can be obtained from a cylindrical tube by pinching without prior processing.

High pressure discharge lamp having pirch seals

An electric discharge lamp has a discharge vessel including pair of opposing planar seals each having a pair of major faces and a pair of minor, side faces. A containment shield surrounds the discharge vessel and includes a glass sleeve and a helically coiled wire secured on the glass sleeve. The glass sleeve is pinched to bevelled ends of the minor, side faces of the seals only and substantially does not engage the major faces of the seal. The wire is fixed around the sleeve in an electrically floating manner, e.g. by clamping fit. With the sleeve secured to the discharge vessel, MH quality photometrics are obtained with a tubular body arc tube without an end coat. The construction of the lamp is simple and effective to protect the outer bulb from being damaged by an explosion of the discharge vessel, and to prevent sodium from disappearing from the discharge vessel as a result of photoemission.

High density discharge lamp with pinched-on containment shield

A high pressure discharge lamp having a discharge vessel with opposing end chambers includes discharge electrodes each consisting of an open elongate filament of refractory metal wire having a plurality of succesive coil turns extending transverse to the longitudinal axis of the discharge vessel. The filament electrodes are dimensioned so that the discharge arc which terminates thereon is sufficiently retracted into the end chamber of the discharge vessel so that the fill constituents condense on a region of the discharge vessel which is primarily axially between the filament electrodes. In a favorable embodiment, the lamp is a metal halide lamp in which the electrode and the discharge sustaining fill is free of thoria and its compounds.

High pressure discharge lamp having filament electrodes

The electric discharge lamp has a discharge vessel, which is mounted in an outer bulb. A containment shield surrounds the discharge vessel and includes a glass sleeve and a helically coiled wire about the sleeve. Electrically isolated clamping leads extending from the seals axially secure the glass sleeve about the discharge vessel so that it is electrically isolated. The wire is fixed around the sleeve in an electrically floating manner, e.g. by clamping fit and/or by bent end portions secured over the ends of the glass sleeve. The construction of the lamp is simple and effective to protect the outer bulb from being damaged by an explosion of the lamp vessel and to prevent accelerated sodium depletion from the discharge vessel.

High pressure discharge lamp having clamped-on containment sleeve

A high pressure lamp assembly having an improved structure for supporting the discharge tube while providing an opening bi-metallic switch for electrically disconnecting the auxiliary electrode. Metallic frames are disposed at the upper and lower ends of the discharge lamp to provide at least partial support to the discharge tube. A non-conductive bridge assembly is connected between the lead through of the auxiliary electrode and a conductive rod extending from the stem. The non-conductive bridge provides at least partial mechanical support to the discharge tube. Connected across the non-conductive bridge is the starting resistor and bi-metallic switch element. When the bi-metallic element is unheated, it provides electrical connection through the starting resistor to the auxiliary electrode. When heated by the heat from the discharge tube, the bi-metallic switch moves out of engagement with the ceramic bridge and thus breaks the electrical connection to the auxiliary electrode.

Bimetal/resistor switch and ceramic bridge assembly for metal halide

A high pressure metal halide discharge lamp having a containment sleeve closed by a pair of metallic end caps for containing arc tube fragments in the event of explosive failure of the arc tube. Insulators secured in the end caps electrically insulate the arc tube lead-throughs from the end caps. Metallic tubes fixed on the lead-throughs butt against the insulators to secure the arc tube between the end caps and hold the end caps against the containment sleeve. Photoelectric emission from the end caps is avoided by electrically isolating the end caps or by providing a dielectric coating on end cap surfaces exposed to ultraviolet radiation.

Growing community of inventors

Painted Post, NY, United States of America

Joseph E Canale