Santa Barbara Infrared, Inc

Other

Research Triangle Institute

Indiana Integrated Circuits, LLC

Joseph Donald LaVeigne

Scott Goodwin

Jason M Kulick

Fouad Kiamilev

Rodney McGee

Stephen W McHugh

John Lañnon

Nicholas Waite

A blackbody radiometric reference comprising a source plate or a target plate, metallic nanoparticles or other high emissivity coating disposed on the plate, and an intermediate coating such as paint. The plate may comprise copper, aluminum or composites thereof. Apparatus capable of functioning as a radiometric or thermometric reference. A pre-heater or weakly-coupled area may be disposed around or adjacent a highly thermally uniform area. A groove or perforations extending into a front surface of the source plate defining a weakly-coupled edge portion surrounding a thermally-controlled, optically-active area, and connected by bridges or structures thereto. An external probe may be located near the source plate for measuring ambient temperature, for compensating for ambient temperature or for radiative load on the blackbody.

Blackbody function

A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.

Techniques for tiling arrays of pixel elements and fabricating hybridized tiles

Sub-arrays such as tiles or chips having pixel elements arranged on a routing layer or carrier to form a larger array. Through-chip vias or the like to the backside of the chip are used for connecting with the pixel elements. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. Edge damage tolerance with minimal loss of function may be achieved by moving unit cell circuitry and the electrically active portions of a pixel element away from the tile edge(s) while leaving the optically active portion closer to the edge(s) if minor damage will not cause a complete failure of the pixel. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like. Various architectures are disclosed.

Techniques for tiling arrays of pixel elements

Drive circuit () for LED thermal emitters in pixel elements of an infrared scene projector (IRSP). At least two current sources (Q, Q, Q) provide output currents (I, I, I) which may be summed and provided to a single LED (), or provided independently to two or more LEDs (A,B). The current sources may have different gains (G, G, G), and different turn-on voltages (Voffset). This allows for different resolutions for different ranges of apparent temperatures, such as high resolution in a low range and low resolution in a high range, thereby facilitating a digital implementation of the drive circuit(s).

Extended dynamic range drive circuit for emitter arrays

Growing community of inventors

Buellton, CA, United States of America

Joseph Donald LaVeigne