General Signal Corporation

Applied Materials, Inc.

General Electric Company

Ge Homeland Protection, Inc.

Exxon Research and Engineering Company

Solarex Corporation

Joseph D Napoli

Joseph A Maher

E John Vowles

Arthur W Zafiropoulo

Mark W Miller

Anthony Jenkins

William Joseph McGann

Kevin Joseph Perry

Hsue C Tsien

Robert W Francis

An apparatus is provided for detecting whether a person has handled explosives, narcotics or other substances of interest. The apparatus includes a metallic sample collection surface on which a person may place a finger. Upon removal of the finger, the metallic sample collection surface is moved to a desorber. The desorber heats the metallic surface sufficiently to vaporize residue transferred from the person. The vaporized residue then is transmitted to a detector for analysis. The detector also may include a fingerprint reading apparatus for reading the fingerprint of the person and comparing the fingerprint to known fingerprint data.

Device for testing for traces of explosives and/or drugs

A device is provided for testing surfaces of a card for the presence of explosives, drugs or other substances of interest. The device includes a slot for receiving the card. Thin metallic wiper blades are dispose in alignment with the slot and wipe over surfaces of the card as the card is passed through the slot. Thus, substances on the surface of the card are transferred to the wiper blade. The wiper blade then is enclosed and rapidly heated to desorb the material retrieved from the card. The enclosure then is placed in communication with a detector to test for the presence of substances of interest.

Device for testing surfaces of articles for traces of explosives and/or drugs

Device for testing traces of explosives and/or drugs

A detector requires a stream of dry air for transporting particles to the detector. The detector then operates to determine whether the dry air has transported any particles of interest. Continuous operation of the detector is permitted by providing first and second dryers that can be operated alternately for drying air that is to be directed to the detector. The dryer that is not being operated is recharged. Air is directed alternately between the first and second dryer to ensure that neither dryer is operated after reaching saturation.

Materials and apparatus for the detection of contraband

An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Integrated processing system having multiple reactors connected to a central chamber

Sample traps or wipes are provided for a detection system for detecting contraband materials. The sample trap is formed from an open weave glass fabric coated with a thin layer of Teflon and roughened to cut through the surface of Teflon and to break some of the glass fibers. Alternatively, the sample trap is non-woven felt fabric made of high temperature polyamide fiber. The sample traps are used in a detector, such as an ion trap mobility spectrometer. The detector includes a desorber which feeds dry air from a manifold above and below the sample trap through a series of holes along the mouth of the desorber. The dry air passes through the trap and purges out unwanted atmospheric constituents that could otherwise affect the performance of the detector. The purged air passes to the outside atmosphere, thus creating a dry curtain at the entry to the desorber.

The present invention includes plural plasma processing vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus. The wafer transfer arm is movable in R and &THgr; between the several plasma etching vessels and the wafer queuing station, and selectably actuatable vacuum locks are provided between each of the plasma etching vessels and the R and &THgr; movable wafer transfer arm to both maintain an intended atmospheric condition and to allow wafer transport therethrough. The plasma vessels each include first and second water-cooled electrodes that are movable relatively to each other so as to provide a selectable gap dimension therebetween. One of the electrodes includes a selectively movable pedestal portion slidably mounted thereto that is cooperative with the R and &THgr; movable wafer transfer arm to load and unload wafers respectively into and out of the associated plasma vessel. The wafer transfer arm is operative to pick-up the wafers by back-side and peripheral wafer contact only, which therewith prevents possible front-side contact-induced contamination of the wafer surfaces. A sensor on the transfer arm is operative to provide a signal indication of proper wafer seating.

Vacuum substrate processing system having multiple processing chambers and a central load/unload chamber

A substrate processing system is provided that includes substrate processing vessels, a substrate queuing station, a substrate transfer device, and a processor. The processor, in communication with the processing vessels, the queuing station, and the transfer device, provides selectable single and multi-step processing of the substrates by accessing a process command for a given substrate corresponding to desired processing of the substrate.

System for processing substrates

The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus. The wafer transfer arm is movable in R and TT between the several plasma etching vessels and the wafer queuing station, and selectably actuatable vacuum locks are provided between each of the plasma etching vessels and the R and TT movable wafer transfer arm to both maintain an intended atmospheric condition and to allow wafer transport therethrough. The plasma vessels each include first and second water-cooled electrodes that are movable relatively to each other so as to provide a selectable gap dimension therebetween. One of the electrodes includes a selectively movable pedestal portion slidably mounted thereto that is cooperative with the R and TT movable wafer transfer arm to load and unload wafers respectively into and out of the associated plasma vessel. The wafer transfer arm is operative to pick-up the wafers by back-side and peripheral wafer contact only, which therewith prevents possible front-side contact-induced contamination of the wafer surfaces. A sensor on the transfer arm is operative to provide a signal indication of proper wafer seating.

Multiple-processing and contamination-free plasma etching system

The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the plasma vessels and the wafer queuing station without atmospheric or other possible contamination. The system is selectively operative in either single-step or multiple-step processing modes. In the preferred embodiment, the plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus. The wafer transfer arm is movable between the plasma etching vessels and the wafer queuing station. Selectably actuable vacuum locks are provided between the plasma etching vessels and the wafer transfer arm to maintain an intended atmospheric condition and to allow wafer transport therethrough. The plasma vessels each include first and second water-cooled electrodes that are movable relatively to each other. The wafer transfer arm is operative to pick-up the wafers by back-side and peripheral wafer contact only. A sensor on the transfer arm provides an indication of proper wafer seating. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels.

System providing multiple processing of substrates

Plural plasma etching vessels and a wafer queuing station are arrayed about a closed pentagonal locus with a wafer transfer arm therewithin all in a controlled vacuum environment. Wafers are movable within the controlled environment between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette, contained within the vacuum environment of the plural plasma etching vessels and wafer queuing station, to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels. The wafer transfer arm is movable in R and .theta.. The plasma vessels each include first and second water-cooled electrodes that are movable relatively to each other so as to provide a selectable gap dimension therebetween. The wafer transfer arm is operative to pick-up the wafers by back-side contact only whereby front-side contact-induced contamination of the wafer surfaces is prevented. A sensor on the transfer arm is operative to provide a signal indication of proper wafer seating.

Method providing multiple-processing of substrates

A system for multichamber processing of semiconductor wafers providing flexibility in the nature of processing available in a multi processing facility. To accommodate changing processing demands and chamber replacement, a mobile processing chamber selectively docks with a multiple chamber system to form one of its processing chambers. The capabilities of the multiprocessing multichamber system are enhanced by extending the system to other multichamber systems through intermediate buffer storage wafer cassette and elevator systems. The extending multichamber system is further provided with intermediate access wafer storage elevator cassettes.

Modular vapor processor system

The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure to that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette, contained within the vacuum environment of the plural plasma etching vessels and wafer queuing station, to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels. In this manner a wafer can be processed as soon as a vessel becomes available.

Quad processor

The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette, contained within the vacuum environment of the plural plasma etching vessels and wafer queuing station, to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels. In this manner a wafer can be processed as soon as a vessel becomes available.

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Windham, NH, United States of America

Joseph D Napoli