Dupont Electronics, Inc.

Rohm & Haas Electronic Materials LLC

Joseph Casey Johnson

Kostantinos Kourtakis

Michael Thomas Kwasny

Husnu Alp Alidedeoglu

Thomas Edward Carney

Christopher Dennis Simone

Kenneth Hernandez

Laila MacLaughlin

Grzegorz Slawinski

Michael Henry Howard, Jr

Gene M Rossi

Ross Stefan Johnson

Scott John Herrmann

Jaclyn Murphy

Christopher Robert Becks

Catherine Mulzer

Lei Zhang

Peggy Scott

Delanie J Losey

Benjamin Samson

Dennis Walls

Neng Xiao

Patricia Gumbley

Cecilia Hall

Lin Ju

Benjamin Naab

In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (S) of the interface between the polymer film and the first metal layer is less than 1 μm. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 μm or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.

Metal-clad polymer films and electronic devices

In a first aspect, an article includes an inorganic substrate and a polymer film layer. The inorganic substrate includes a material including a ceramic, a glass, a glass-ceramic or a mixture thereof. The material includes a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof and oxygen. The polymer film layer includes a polymer including an imide group. From an interface where the inorganic substrate contacts the polymer film layer, a line-profile of a CNO− signal from negative secondary ion mass spectroscopy decreases as it moves away from the interface and into the bulk of the polymer film layer.

Articles having inorganic substrates and polymer film layers

In a first aspect, a coating solution includes a soluble polymer and a crosslinking precursor. The soluble polymer includes an imide group. The crosslinking precursor includes a first amine group that is either reactive or passivated towards crosslinking and one or more additional amine groups, wherein the one or more additional amine groups has been passivated towards crosslinking such that the crosslinking precursor can be chemically converted, thermally converted, photo-converted or dissociated to form at least two reactive amines. In a second aspect, a process for forming a polymer film includes: (a) casting a coating solution, (b) activating the crosslinking precursor using an external stimulus to form at least two reactive amines and crosslink the polymer, and (c) drying the polymer film. The coating solution includes a soluble polymer, including an imide group, and a crosslinking precursor.

Coating solutions and crosslinked polymer films

In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60&#xb0; gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S) of 7 &#x3bc;m or more, an L* of 33 or less and a 60&#xb0; gloss of 10 or less.

Single layer polymer films and electronic devices

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Dof 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g&#xd7;mil)/(m&#xd7;day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

Polymer films and electronic devices

In a first aspect, a polyimide corn position has a glass transition temperature of less than 300&#xb0; C. and includes a polyimide derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. A polyimide film made from the polyimide composition has a b* of less than one for a film thickness of at least 30 microns.

Polyimide compositions and polyimide solutions

In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 &#x3bc;m. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film.

Polyimide films and electronic devices

In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S) of 6 &#x3bc;m or more, an L* color of 30 or less and a 60&#xb0; gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.

In a first aspect, a polyimide film includes a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. The polyimide film has a b* of less than one for a film thickness of at least 30 microns and a glass transition temperature of less than 300&#xb0; C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

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Pickerington, OH, United States of America

Joseph Casey Johnson