Apple Inc.

Crucible Intellectual Property, LLC

Other

Joseph C Poole

Christopher D Prest

Theodore Andrew Waniuk

Matthew S Scott

Dermot J Stratton

Joseph W Stevick

Sean Timothy O'Keeffe

Stephen Paul Zadesky

Quoc Tran Pham

Matthew S Rogers

Naoto Matsuyuki

Michael S Nashner

Richard Walter Heley

Jeffrey Lee Mattlin

Dale N Memering

David I Nazzaro

Lucy Elizabeth Browning

Kevin M Kenney

Scott A Myers

Colin M Ely

James R Wilson

Christopher D Jones

James A Curran

Dhaval N Shah

Nicholas George Merz

Gregory N Stephens

Marta M Giachino

Zechariah D Feinberg

Victor Luzzato

Kyle J Nekimken

Samuel O Schneider

The disclosure provides members formed from multiple layers as well as enclosures and electronic devices that include the members. The members include glass members formed from multiple layers of glass. In some cases, the members include a protruding feature provided over a camera assembly of the electronic device. The member may define one or more through-holes that extend through the protruding feature. The protruding feature may define a textured region that may be configured to provide a matte or glossy appearance.

Glass cover member for an electronic device enclosure

A glass component of an electronic device housing may define a textured surface having micro-scale tactile friction features that provide a specified friction between a user's finger and the glass component. More specifically, the tactile friction features may reduce a contact surface area that is in contact with the user's finger in order to produce a reduced or specified coefficient of friction.

Housing surface with tactile friction features

A textured enclosure component including two different types of surface features is disclosed. The two different types of surface features are differently sized. The combination of differently sized surface features provides both anti-glare and anti-reflective properties to the enclosure component.

Antireflective treatment for textured enclosure components

An electronic device may have a display for displaying images. The display may be coupled to a housing on a front face of the device. The housing may have a transparent portion on an opposing rear face of the device. The electronic device may have structures with an adjustable appearance. The adjustable-appearance structures may include a mask with openings or other mask elements and a corresponding overlapped patterned layer containing an array of visual elements. The visual elements may have different appearances, so that movement of the mask relative to the patterned layer changes the appearance of the adjustable-appearance structures. The state of the adjustable-appearance structure may be changed during use of the device by a user or may be adjusted then fixed during manufacturing.

Electronic devices with adjustable-appearance housing structures

Oxide coatings that reduce or eliminate the appearance of thin film interference coloring are described. In some embodiments, the oxide coatings are configured to reduce the appearance of fingerprints. In some cases, the oxide coatings are sufficiently thick to increase the optical path difference of incident light, thereby reducing any inference coloring by the fingerprint to a non-visible level. In some embodiments, the oxide coatings have a non-uniform thickness that changes the way light reflects off of interfaces of the oxide coating, thereby reducing or eliminating any thin film interference coloring caused by the oxide coatings themselves or by a fingerprint.

Oxide coatings for metal surfaces

A housing or enclosure for an electronic device is formed from a shell and chassis may positioned along an interior of the shell. The shell may be formed from a hard or cosmetic material and the chassis may be formed from a machinable material. The chassis may define one or more machined surfaces that are configured to receive or mount a component of the electronic device.

Enclosure for an electronic device having a shell and internal chassis

A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

Co-molded ceramic and polymer structure

Embodiments herein relate to a heat sink having nano- and/or micro-replication directly embossed in a bulk solidifying amorphous alloy comprising a metal alloy, wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air or forced convection by air, or by fluid phase change of a fluid and/or liquid cooling by a liquid. Other embodiments relate apparatus having the heat sink. Yet other embodiments relate to methods of manufacturing the heat sink and apparatus having the heat sink.

Bulk amorphous alloy heat sink

Described herein is a feedstock comprising BMG. The feedstock has a surface with an average roughness of at least 200 microns. Also described herein is a feedstock comprising BMG. The feedstock, when supported on a support during a melting process of the feedstock, has a contact area between the feedstock and the support up to 50% of a total area of the support. These feedstocks can be made by molding ingots of BMG into a mole with surface patterns, enclosing one or more cores into a sheath with a roughened surface, chemical etching, laser ablating, machining, grinding, sandblasting, or shot peening. The feedstocks can be used as starting materials in an injection molding process.

Manipulating surface topology of BMG feedstock

Various embodiments provide apparatus and methods for melting materials and for containing the molten materials within melt zone during melting. Exemplary apparatus may include a vessel configured to receive a material for melting therein; a load induction coil positioned adjacent to the vessel to melt the material therein; and a containment induction coil positioned in line with the load induction coil. The material in the vessel can be heated by operating the load induction coil at a first RF frequency to form a molten material. The containment induction coil can be operated at a second RF frequency to contain the molten material within the load induction coil. Once the desired temperature is achieved and maintained for the molten material, operation of the containment induction coil can be stopped and the molten material can be ejected from the vessel into a mold through an ejection path.

Inline melt control via RF power

Described herein are methods of constructing a part having improved properties using metallic glass alloys, layer by layer. In accordance with certain aspects, a layer of metallic glass-forming powder is deposited to selected positions and then fused to a surface layer (i.e. layer below) by suitable methods such as laser heating or electron beam heating. The deposition and fusing are then repeated as need to construct the part, layer by layer. In certain embodiments, one or more sections or layers of non-metallic glass-forming material can be included as needed to form a composite final part. In certain aspects, the metallic glass-forming powder may be crystalized during depositing and fusing, or may be recrystallized during subsequent processing to provide selectively crystalized sections or layers, e.g., to impart desired functionality. In other aspects, non-metallic glass-forming materials may be deposited and fused at selected positions, e.g., to provide selective shear banding to impart improved ductile properties and plasticity. In yet other aspects, the metallic glass-forming powder or metallic glass material and non-metallic glass-forming material are deposited and fused to form a foam-like, bellow or similar structure, which is able to crumple under high stress to absorb energy under impact.

Methods for constructing parts with improved properties using metallic glass alloys

Embodiments relates to a hook side fastener having hooks and a loop side fastener having loops. The hooks and/or loops are made of bulk solidifying amorphous metal alloy. Other embodiments relate to methods of making and using the hook side and loop side fasteners.

Fasteners of bulk amorphous alloy

Provided in one embodiment is a method of forming a connection mechanism in or on a bulk-solidifying amorphous alloy by casting in or on, or forming with the bulk-solidifying amorphous alloy, a machinable metal. The connection mechanism can be formed by machining the machinable metal.

Insert casting or tack welding of machinable metal in bulk amorphous alloy part and post machining the machinable metal insert

Methods and apparatus for creating an integral assembly formed from a transparent member and a housing formed at least in part of a bulk-solidifying amorphous alloy. The methods and systems create integral transparent member and amorphous metal alloy-containing parts using thermoplastic molding techniques in which the amorphous metal is molded to the transparent member in a thermoplastic, not liquid, state.

Growing community of inventors

San Francisco, CA, United States of America

Joseph C Poole