Intel Corporation

Joseph C Krauskopf

Ravindranath Vithal Mahajan

Robert Starkston

Kevin J Haley

Charles A Gealer

Niel C Delaplane

A method and apparatus for controlling the thickness of a thermal interface between a processor die and a thermal plate in a microprocessor assembly are provided. The apparatus includes a generally rectangular shaped thermal top cover having a recessed portion of predetermined depth and aperture therein. The thermal top cover fits over the processor die. A thermal interface layer fills the recessed portion of the thermal top cover covering the processor die. The depth of the recessed portion is greater than the thickness of the processor die so that the thickness of the thermal interface layer is controlled. A thermal plate is placed over the thermal top cover in contact with the thermal grease so as to form a thermal path from the processor die to the thermal plate.

Thermal interface thickness control for a microprocessor

A breakpoint apparatus incorporated in a single chip microprocessor. The apparatus permits breakpoints on specific references to either program instructions or data. The width of the breakpoint address can be varied, the apparatus includes a logic circuit for determining if the reference represented by the breakpoint address overlaps the current virtual address.

Microprocessor breakpoint apparatus

A three input binary adder with only a single carry path. First adder circuits receive one bit of each of the three words of the same significance. Second cells which include a carry path are coupled to the first circuits such that one of the bits of lower significance from the first circuits is coupled to one of the cells and the other bit from the first circuit is coupled to the next of the cells along the carry path.

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Santa Clara, CA, United States of America

Joseph C Krauskopf