International Business Machines Corporation

Joseph C Andreshak

Lubomyr Taras Romankiw

Madhav Datta

Robert J Baseman

Stephen Eric Levy

Pedro A Chalco

John M Lucassen

John Karat

Robert Lawrence Mack

Luis F Vega

Gregg H Daggett

An interactive computer system having a processor executing a target computer program, and having a speech recognizer for converting an utterance into a command signal for the target computer program. The target computer program has a series of active program states occurring over a series of time periods. At least a first active-state image is displayed for a first active state occurring during a first time period. At least one object displayed in the first active-state image is identified, and a list of one or more first active-state commands identifying functions which can be performed in the first active state of the target computer program is generated from the identified object. A first active-state vocabulary of acoustic command models for the first active state comprises the acoustic command models from a system vocabulary representing the first active-state commands. A speech recognizer measures the value of at least one feature of an utterance during each of a series of successive time intervals within the first time period to produce a series of feature signals. The measured feature signals are compared to each of the acoustic command models in the first active-state vocabulary to generate a match score for the utterance and each acoustic command model. The speech recognizer outputs a command signal corresponding to the command model from the first active-state vocabulary having the best match score.

Interactive computer system recognizing spoken commands

A laser ablation damascene process for the planarizing of metal/polymer structures. More specifically, the process is especially adapted for the fabrication of both interlevel via metallization and circuitization layers in integrated circuit (IC) interconnects. Subsequent to the forming or etching of holes or depressions in a polymer insulating layer, a metal layer or film is deposited thereon for the purpose of fabricating vias or trenches for metallization and circulation layers in IC connects. Thereafter, the surface of the metal layer which has been deposited or superimposed on the polymer substrate through any suitable method known in the art is irradiated with at least one laser pulse which will cause the metal layer to melt and reflow and resultingly fill the vias and trenches etched in the polymer substrate while simultaneously ablating and removing the metal from the planarized surface of the substrate in the regions about the vias and trenches.

Laser ablation damascene process

An apparatus is provided for electrochemically processing an anodic material in strip form, such as the stainless steel print bands used in high speed printers. Also provided is an electrochemical process including electroetching, electropolishing, or both to obtain microfinishing of the material. Moreover, an electrolyte is provided which is a mixture of phosphoric acid, sulfuric acid, and glycerol in which the material removal rate is controlled by the addition of small amounts of sodium chloride. The electrochemical process operates at ambient temperature over a wide range of current density.

Apparatus, electrochemical process, and electrolyte for microfinishing

A laser assisted miniature heater 10 includes an elongated hollow bar 12 having a high thermal conductivity and a supporting member 14 for conveying an optical fiber 16 which transmits laser radiation to an interiorly disposed hollow cavity 18. The interior surfaces 20 of the cavity 18 are reflective to the laser radiation such that the radiation undergoes repetitive internal reflections along a longitudinal axis of the bar 12. While repetitively reflecting within the cavity 18 the laser radiation is gradually absorbed into the walls of the cavity 18. The absorption of the laser radiation induces a uniform heating of the bar 12 to a temperature which exceeds the melting temperature of eutectic solder. The outer surface 22 of the bar 12, when placed in contact with a plurality of component leads which are each adjacent to a respective solder-bearing bonding pad, induces a melting of the solder and the physical and electrical coupling of the leads to their associated bonding pads.

Laser assisted heater bar for multiple lead attachment

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Mahopac, NY, United States of America

Joseph C Andreshak