Emc Technology, Inc.

Lamina Ceramics, Inc.

Lighting Science Group Corporation

Eastern Optx, Inc.

Lamina Lighting, Inc.

Joseph B Mazzochette

Jerome Lomurno

Edward J MacMullen

Greg E Blonder

Edward Ernest Bailey

Robert J Blacka

Robert J Burdalski

Howard Salvesen

David Markman

Barry Jay Thaler

Ellen Schwartz Tormey

Edmar Amaya

Andrew Beregszaszi

Ashok Narayan Prabhu

John Charles Connolly

Ramon Ubaldo Martinelli

Andrew Howard Beregszaszi

Mark Stuart Hammond

Ponnuswamy Palanisamy

John Ekis

John R Steponick

Attiganal Narayanaswamysreeram

Lin Li

A system simulates a moving target for a radar system under test. The system includes a Doppler simulation circuit (DSC), coupled to an input, to apply a frequency shift to RF pulses received on an RF signal to simulate speed. A signal attenuator coupled to the DSC is to simulate signal attenuation due to propagation loss of the RF pulses in atmosphere. A pulse detection circuit is to detect time of receipt of the RF pulses, including a first time of receipt of a falling edge of a first RF pulse. An I/O controller updates a value of the frequency shift for the DSC and of the signal attenuation for the signal attenuator during a time period between the first RF pulse and one of a second RF pulse or a second time at which the second RF pulse should have been received in case of a missing pulse.

High speed radar test system

A test system simulates a moving target for a radar system under test. The test system includes a Doppler simulation circuit, coupled to an input, to apply a frequency shift to RF pulses received on an RF signal generated by the radar system to simulate speed. A signal delay sub-system produces a delay in the RF pulses to simulate distance. A pulse detection circuit is to detect time of receipt of the RF pulses, including a first time of receipt of a falling edge of a first RF pulse. An I/O controller updates a value of the frequency shift for the Doppler simulation circuit and of the delay for the signal delay sub-system during a time period between the first RF pulse and one of a second RF pulse or a second time at which the second RF pulse should have been received in case of a missing pulse.

A radar test computing system includes a host interface coupled to a programmable input/output (I/O) controller, which is to interface with propagation path replicator (PPR) circuitry. A processing device is to detect a start signal received from the controller; receive an update request from the controller in response to detection, by the PPR circuitry, of a first radio RF pulse on a RF signal received from the radar system; retrieve scenario data of distance to and speed of the moving target for a second RF pulse expected to follow the first RF pulse; calculate, using retrieved scenario data, values of a frequency shift, a signal delay, and a signal attenuation for the second RF pulse; and send, during a time period between the first and second RF pulses, these values to the controller for use by the PPR circuitry to simulate the moving target for the second RF pulse.

High speed radar test system processing and logic

An apparatus for simulating radio frequency (RF) signal propagation characteristics in a wireless communication network is disclosed. The apparatus includes a set of optical modulators in electrical communication with corresponding ones of a set of RF terminals. A set of optical demodulators is in optical communication with corresponding ones of the set of optical modulators and corresponding ones of the set of RF terminals. A set of optical delay lines may be configured to be in optical communication with the corresponding ones of the set of optical modulators and the corresponding ones of the set of optical demodulators.

Bi-directional, compact, multi-path and free space channel replicator

An apparatus for simulating radio frequency (RF) signal propagation characteristics in a wireless communication network is disclosed. The apparatus includes a first RF terminal and a second RF terminal. A first optical modulator is in electrical communication with the first RF terminal. An optical delay line is in optical communication with the first optical modulator. A first optical demodulator is in optical communication with the optical delay line and in electrical communication with the first RF terminal. A second optical demodulator is in optical communication with the optical delay line and in electrical communication with the second RF terminal. A second optical modulator is in electrical communication with the second RF terminal and in optical communication with the optical delay line.

A solid state light engine includes a bridge rectifier having a rectified output. At least one light emitting diode (LED) is connected to the bridge rectifier, the at least one LED including a die portion, a layer of phosphor free resin positioned upon the die portion, and a plurality of phosphor particles adhered to the layer of phosphor free resin. A pair of AC power input terminals are electrically connected to the input of the bridge rectifier for use in coupling the bridge rectifier to an AC power source. A pair of DC power input terminals are connected to the rectified output of the bridge rectifier for use in coupling the bridge rectifier to a circuit productive of a DC voltage at the pair of DC power terminals. The layer of phosphor free resin includes a polymeric resin.

Solid state LED bridge rectifier light engine

A solid-state light engine comprised of light emitting diodes (LEDs) configured into a bridge rectifier with a current limiting module coupled to the LED bridge rectifier. The light engine may be packaged for high temperature operation. Optionally, the LEDs comprise wavelength-converting phosphors with a persistence that is a multiple of the peak to peak current period, to smooth and mask ripple frequency pulsation of emitted light.

A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.

LED package with stepped aperture

An optimized light source and a method of manufacturing the same. The light source is made up of an array of individual lighting elements and is optimized for electrical, optical and economic performance, as well as a method for configuring such an array. The a process for selecting individual lighting elements is based on characterizing and sorting individual lighting elements based on performance so that the performance of the overall array is improved by combing individual lighting elements whose individual performance might not otherwise meet the performance of the overall array.

Light source with optimized electrical, optical, and economical performance

A display backlight assembly providing improved optical coupling between a solid state light source and a display optical light guide. The assembly includes an optical coupler to couple the solid state light source and display optical light guide together. In addition, the optical coupler may include a light mixing element for improved mixing of the multi-colored or mono-chromatic light produced by the solid state light source.

Display backlight with improved light coupling and mixing

In accordance with the invention, a light emitting diode package assembly is provided to emulate the pattern of light produced by an incandescent filament bulb. The package assembly is composed of a substrate for LEDs comprising a heat-sinking base having a pair of opposing major surfaces. Each major surface has an overlying of thermally conducting ceramic and an outer surface layer of light reflective material. Disposed on each surface layer is a plurality of LEDs. Advantageously, the LEDs are arranged on the surface in a configuration of low mutual obstruction. Advantageously, reflecting elements transverse to each surface layer are positioned and shaped to reflect a substantial portion of the light emitted from the LEDs that would otherwise enter neighboring LEDs. In a preferred embodiment, the LEDs are arranged in the general form of a closed curve, and a transverse reflector is disposed in the interior of the curve. Alternatively, the LEDs can be arranged in a linear array. The assembly can be efficiently fabricated by back-to-back assembly of two similar subassemblies.

Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb

A light emitting diode with improved light collimation comprises a substrate-supported LED die disposed within a transparent dome. A portion of the dome laterally circumscribe the die comprises light reflecting material to reflect emitted light back to the die. A portion of the dome centrally overlying the die is substantially free of light reflecting material to permit exit of light within a desired radiation pattern. The LED die may be packaged for high temperature operation by disposing them on a ceramic-coated metal base which can be coupled to a heat sink. The packaged LED can be made by the low temperature co-fired ceramic-on-metal technique (LTCC-M).

Light emitting diodes with improved light collimation

In accordance with the invention, an illumination device comprises a highly thermally conductive substrate having a surface, a plurality of light emitting diodes (LEDs) supported by the surface and arranged in an array to provide illumination. At least one reflective barrier at least partially surrounds each LED. The reflective barrier is shaped to reflect away from the LED light emitted by other LEDs in the array. Advantageously the LEDs and reflective barrier are thermally coupled to a heat spreader to dissipate heat generated by the LEDs. The substrate preferably comprises an LTTC-M heat spreader, and the reflective thermal barriers preferably comprise metal ridges or cups.

Growing community of inventors

Cherry Hill, NJ, United States of America

Joseph B Mazzochette