Harris Corporation

Joseph B Brief

Gregory M Jandzio

Donald J Beck

Robert S Vinson

Ying-Ming Lee

Robert Grayson Wells

James William Carpenter

An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

Decoupling capacitor closely coupled with integrated circuit

A ruggedized, snap-together, module securely retains a pair of mutually abutting fiber optic interconnect MT ferrules, that have been joined together by a ferrule aligning pin clamp structure. The module includes a generally rectangular base member having a ferrule retention cavity that is configured to retain a pair of MT ferrules and an associated pin clamp assembly therefor. A cover is configured to engage the base in such a manner that the two MT ferrules are firmly held in their intended face-to-face abutting condition as captured between the base and the cover. A bias compression spring is captured between the cover and the base in a manner that facilitates removal of the cover when it is desired to open the module and gain access to the two MT ferrules.

Ruggedized module for securely retaining multi-optical fiber interconnect ferrules

Growing community of inventors

West Melbourne, FL, United States of America

Joseph B Brief