Applied Materials, Inc.

Joseph Aubuchon

Sanjeev Baluja

Dhritiman Subha Kashyap

Prahallad Iyengar

Hanhong Chen

Arkaprava Dan

Gas distribution plate

Apparatus and methods to process one or more wafers are described. A spatial deposition tool comprises a plurality of substrate support surfaces on a substrate support assembly and a plurality of spatially separated and isolated processing stations. The spatially separated isolated processing stations have independently controlled temperature, processing gas types, and gas flows. In some embodiments, the processing gases on one or multiple processing stations are activated using plasma sources. The operation of the spatial tool comprises rotating the substrate assembly in a first direction, and rotating the substrate assembly in a second direction, and repeating the rotations in the first direction and the second direction until a predetermined thickness is deposited on the substrate surface(s).

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San Jose, CA, United States of America

Joseph Aubuchon