Lucent Technologies Inc.

Enthone Incorporated

At&t Bell Laboratories

Other

Macdermid Enthone Gmbh

Bell Telephone Laboratories

At+t Corp.

Agere Systems Guardian Corp.

Joseph Anthony Abys

Chonglun Fan

Igor V Kadija

Chen Xu

Thomas B Richardson

Shenliang Sun

Theodore Antonellis

Edward J Kudrak

Cai Wang

Joseph J Maisano, Jr

Vincent Paneccasio, Jr

Yun Zhang

Joseph John Maisano

Heinrich K Straschil

Xuan Lin

Yung-Herng Yau

Chen Wang

Karl F Wengenroth

Richard W Hurtubise

Yutaka Okinaka

Wenbo Shao

Alan Blair

Brian T Smith

Anthony Fiore

Conor Anthony Dullaghan

John Fudala

Edward J Kudrak, Jr

Qingyun Chen

Abayomi I Owei

Catherine Wolowodiuk

Harvey S Trop

Pingping Ye

Vincent Paneccasio

Jingye Li

Kenneth J Murski

Bruce F Stacy

Peter Epstein

Virginia T Eckert

Shohei Nakahara

Marlies Kleinfeld

Christian Rietmann

Ortrud Steinius

Frank Stanley Humiec

Michael L Ammerman

Jimmy Chun Wah Kwok

Lars Goran Holmbom

Eric Walch

Vijay Chinchankar

Sean Xuan Lin

Xingping Wang

Joseph John Maisano, Jr

Robert Farrell

Irina Boguslavsky

Igor Zavarine

Katrin Zschintzsch

Jean Rasmussen

Jr Vincent Paneccasio

A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.

Process for filling vias in the microelectronics

A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature. The deposition composition comprises (a) a source of copper ions; (b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof; (c) an organic disulfide compound; (d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and (d) chloride ions.

Copper filling of through silicon vias

A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.

Corrosion protection of bronzes

Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.

Silver plating in electronics manufacture

Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.

Adhesion promotion in printed circuit boards

A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Electrolytic deposition of metal-based composite coatings comprising nano-particles

A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217&#xb0; C. followed by cooling to a temperature between about 20&#xb0; C. and about 28&#xb0; C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.

Immersion tin silver plating in electronics manufacture

There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.

Composite coatings for whisker reduction

A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25&#xb0; C.

Metallic surface enhancement

A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.

Anti-tarnish coatings

A composition for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate. The composition comprises: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.

Self assembled molecules on immersion silver coatings

Growing community of inventors

Guilford, CT, United States of America

Joseph Anthony Abys