Intel Corporation

Joseph Andrew Broderick

Mark E Sprenger

Barrett M Faneuf

Devdatta P Kulkarni

Brian S Jarrett

Kenan Huseyin Arik

Eric Dwight McAfee

Kristin L Weldon

Aaron P Anderson

Emery E Frey

Annie Chen

Juan G Cevallos

Jaime A Sanchez

Jessica Gulbrand

Juan Gabriel Cevallos Palomeque

A quick disconnect fitting includes a plug and a socket to receive the plug. The plug includes a fluid channel, an inlet to the fluid channel, and a pressure regulating valve assembly. The valve can include a poppet, and a valve nozzle comprising an orifice. The valve assembly resides in the fluid channel. The socket includes a socket stem to contact the valve assembly and push the valve assembly into the fluid channel of the plug upon the socket receiving the plug.

Pressure regulator valve assembly for quick disconnect fittings

Coupling interface

Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.

Non-planar conforming heatsink

Couplings are disclosed herein. A plug of a coupling includes a plug body and a socket interface coupled to the plug body. The socket interface includes a shoulder extending axially outward from the plug body, a neck extending axially outward and radially inward from the shoulder, and a socket guide extending axially outward and radially outward from the neck.

Universal quick disconnect

Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

System to reduce coolant use in an array of circuit boards

Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

Mechanism with folded wrapping to seal components immersed in coolant

Growing community of inventors

Beaverton, OR, United States of America

Joseph Andrew Broderick