Samsung Electronics Co., Ltd.

Joseph Ahn

Kyungha Koo

Hongki Moon

Hyunjoo Lee

Yoonsun Park

Youngjae You

According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

Electronic device including heat dissipation structure

An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Growing community of inventors

Suwon-si, South Korea

Joseph Ahn