Brooks Automation Gmbh

Brooks Automation Us, LLC

Joseph A Kraus

Christopher A Hofmeister

William John Fosnight

Alexander G Krupyshev

Joseph Hallisey

Craig J Carbone

Jeffrey C Blahnik

Ho Yin Owen Fong

Martin R Elliott

Martin R Elliot

Allen J Bartlett

Michael J Eacobacci, Jr

A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Load lock fast pump vent

Load lock chamber

A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.

A cluster tool has a transfer chamber, and a load lock chamber. An adaptor is configured to be coupled between the transfer chamber and the load lock chamber. The adaptor has an adaptor housing with an interior space including an entrance with a first valve and an exit with a second valve. The adaptor housing forms a substrate path through the interior space. The first valve connects the interior space and the load lock chamber. The second valve connects the interior space and the transfer chamber. A cryogenic surface is associated with the adaptor. Other pumps can be associated with the adaptor, such as, for example, a turbo pump, or water vapor pump. The cryogenic surface is configured to selectively evacuate the interior space. A wafer is adapted to be moved through the first valve and through the adaptor housing along the path. The wafer is moved through the exit and into the transfer chamber once the second valve is opened. This adaptor can be applied to the process chamber as well as the load lock.

Integral facet cryopump, water vapor pump, or high vacuum pump

Growing community of inventors

Pepperell, MA, United States of America

Joseph A Kraus