Sandia Corporation

Fisher Barton, Inc.

Joseph A Henfling

William J Lenling

Scott C Lindblom

Mark F Smith

Frank J Maldonado

An amplifier circuit in a multi-chip module includes a charge to voltage converter circuit, a voltage amplifier a low pass filter and a voltage to current converter. The charge to voltage converter receives a signal representing an electrical charge and generates a voltage signal proportional to the input signal. The voltage amplifier receives the voltage signal from the charge to voltage converter, then amplifies the voltage signal by the gain factor to output an amplified voltage signal. The lowpass filter passes low frequency components of the amplified voltage signal and attenuates frequency components greater than a cutoff frequency. The voltage to current converter receives the output signal of the lowpass filter and converts the output signal to a current output signal; wherein an amplifier circuit output is selectable between the output signal of the lowpass filter and the current output signal.

High temperature charge amplifier for geothermal applications

A method is disclosed for spray coating material which employs a plasma gun that has a cathode, an anode, an arc gas inlet, a first powder injection port, and a second powder injection port. A suitable arc gas is introduced through the arc gas inlet, and ionization of the arc gas between the cathode and the anode forms a plasma. The plasma is directed to emenate from an open-ended chamber defined by the boundary of the anode. A coating is deposited upon a base metal part by suspending a binder powder within a carrier gas that is fed into the plasma through the first powder injection port; a material subject to degradation by high temperature oxygen reactions is suspended within a carrier gas that is fed into the plasma through the second injection port. The material fed through the second injection port experiences a cooler portion of the plasma and has a shorter dwell time within the plasma to minimize high temperature oxygen reactions. The material of the first port and the material of the second port intermingle within the plasma to form a uniform coating having constituent percentages related to the powder-feed rates of the materials through the respective ports.

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Bosque Farms, NM, United States of America

Joseph A Henfling